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ELECTRONIC COMPONENTS

Heat Sinks

Explore Heat Sinks parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to ICMENU. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
342950 Boyd Laconia, LLC

342950

COPPER HEATSINK 90X90X10MM

Boyd Laconia, LLC

1,204
Datasheet - Tray Active Top Mount, Skived BGA Push Pin Square, Fins 3.543" (90.00mm) 3.543" (90.00mm) - 0.394" (10.00mm) - 1.30°C/W @ 200 LFM 4.50°C/W Copper AavSHIELD 3C
34097 Trenz Electronic GmbH

34097

COOLJAG BUF-A4 FANSINK FOR TRENZ

Trenz Electronic GmbH

2,823
Datasheet - Bulk Active - - - - - - - - - - - - -
342946 Boyd Laconia, LLC

342946

COPPER HEATSINK 60X60X22MM

Boyd Laconia, LLC

1,506
Datasheet - Tray Active Top Mount, Skived BGA Push Pin Square, Fins 2.362" (60.00mm) 2.362" (60.00mm) - 0.866" (22.00mm) - 0.80°C/W @ 300 LFM 7.20°C/W Copper AavSHIELD 3C
HSET875-X-1 iBASE Technology

HSET875-X-1

HEAT SPREADER FOR ET875-X7/ X5,

iBASE Technology

4,118
Datasheet - Box Active Heat Spreader ET875-x7/x5Q/x5 - - - - - - - - - - -
HSIB918-A iBASE Technology

HSIB918-A

AC, HEATSINK + FAN FOR IB918 SER

iBASE Technology

2,959
Datasheet - Box Active Top Mount IB918 - - - - - - - - - - -
9-1542005-7 TE Connectivity AMP Connectors

9-1542005-7

35MM HS ASSY ULTEM C

TE Connectivity AMP Connectors

2,061
Datasheet - Box Obsolete Top Mount with Fan BGA Clip Cylindrical, Pin Fins - - 1.985" (50.42mm) OD 0.680" (17.27mm) - 2.90°C/W @ 200 LFM 7.90°C/W Aluminum Black Anodized
40519 Vicor Corporation

40519

BOM ASSY 4623 DUAL HTSNK 11MM

Vicor Corporation

4,787
Datasheet * Bulk Active - - - - - - - - - - - - -
125562 Wakefield-Vette

125562

4.429WX11.81" EXTRUS 17080-11.81

Wakefield-Vette

4,751
Datasheet - Box Active Top Mount, Extrusion - Adhesive Rectangular, Fins 11.810" (299.97mm) 4.429" (112.50mm) - 3.276" (83.21mm) - - 0.15°C/W Aluminum -
125386 Wakefield-Vette

125386

5WX36" EXTRUSION 16936 XX7330

Wakefield-Vette

4,397
Datasheet - Box Active Board Level, Extrusion Power Modules Bolt On Rectangular, Fins 36.000" (914.40mm) 5.000" (127.00mm) - 2.500" (63.50mm) - - 0.43°C/W Aluminum -
SF4P2U-F002-A01 Cooltron Industrial Supply

SF4P2U-F002-A01

Intel FCLGA 3647 Square ILM 2U

Cooltron Industrial Supply

1,443
Datasheet Intel FCLGA 3647 Bulk Active Top Mount with Fan Intel LGA3647 2U Active CPU Cooler Push Pin Rectangular, Fins 3.583" (91.00mm) 3.465" (88.00mm) - 2.519" (64.00mm) 205.0W @ 33.46°C - 0.16°C/W Aluminum, Copper -
465K-MOD Wakefield-Vette

465K-MOD

HEAT SINKS STUD MOUNTED DIODE BO

Wakefield-Vette

2,732
Datasheet - Bulk Active - - - - - - - - - - - - -
SF4P2U-F005-A01 Cooltron Industrial Supply

SF4P2U-F005-A01

AMD SP3 & sTRX4 Series 240W 2U S

Cooltron Industrial Supply

1,335
Datasheet AMD SP3 and sTRX4 Bulk Active Top Mount with Fan AMD SP3 2U Active CPU Cooler, AMD sTRX4 2U Active CPU Cooler Push Pin Rectangular, Fins 4.724" (120.00mm) 3.150" (80.00mm) - 2.500" (63.50mm) 240.0W @ 32.78°C - 0.14°C/W Aluminum, Copper -
125577 Wakefield-Vette

125577

10.827WX12" EXTRUSION 19572

Wakefield-Vette

3,469
Datasheet - Box Active Top Mount, Extrusion - Adhesive Rectangular, Fins 12.000" (304.80mm) 10.827" (275.01mm) - 1.220" (31.00mm) - - 0.21°C/W Aluminum -
HSET870-A iBASE Technology

HSET870-A

HEATSINK FOR ET870 (H051HSET8700

iBASE Technology

1,349
Datasheet - Box Active Top Mount ET870 - - - - - - - - - - -
HSET870-1 iBASE Technology

HSET870-1

HEAT SPREADER FOR ET870 (H051HSE

iBASE Technology

1,741
Datasheet - Box Active Heat Spreader ET870 - - - - - - - - - - -
486K Wakefield-Vette

486K

HEATSINK HIGH PWR RECT/DIODES

Wakefield-Vette

4,150
Datasheet 486 Bulk Active Board Level, Extrusion Stud Mounted Diode Press Fit Rectangular, Fins 6.000" (152.40mm) 6.520" (165.61mm) - 6.520" (165.61mm) 50.0W @ 24°C 0.20°C/W @ 250 LFM - Aluminum Black Anodized
342950-COPPER SKIVFIN Boyd Laconia, LLC

342950-COPPER SKIVFIN

342950,REV02(GP)

Boyd Laconia, LLC

1,345
Datasheet - Bulk Active Board Level BGA, FPGA Push Pin, Thermal Material Square, Fins 3.543" (90.00mm) 3.543" (90.00mm) - 0.394" (10.00mm) - - - Copper -
V5583B Assmann WSW Components

V5583B

PROFILE HEATSINK

Assmann WSW Components

1,272
Datasheet - Bulk Active - - - - - - - - - - - - -
V6716B Assmann WSW Components

V6716B

PROFILE HEATSINK

Assmann WSW Components

1,328
Datasheet - Bulk Active - - - - - - - - - - - - -
125454 Wakefield-Vette

125454

10.5WX12" EXTRUSION 16990 XX2904

Wakefield-Vette

1,825
Datasheet - Box Active Top Mount, Extrusion - Adhesive Rectangular, Fins 12.000" (304.80mm) 10.500" (266.70mm) - 1.265" (32.13mm) - - 0.33°C/W Aluminum -
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FAQ

Frequently Asked Questions

What are Heat Sinks components used for?

Heat Sinks components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right Heat Sinks part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can ICMENU help source obsolete or hard-to-find Heat Sinks parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. ICMENU will review your request and provide available stock, pricing and sourcing information.

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