Heat Sinks
Explore Heat Sinks parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to ICMENU. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Package Cooled | Attachment Method | Shape | Length | Width | Diameter | Fin Height | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material | Material Finish |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
512-3MHEATSINK FOR PWR MOD/IGBT/RELAY |
4,824 |
|
Datasheet | 512 | Bulk | Active | Top Mount | Power Modules | Adhesive | Rectangular, Fins | 3.000" (76.20mm) | 7.200" (182.88mm) | - | 2.350" (59.69mm) | - | - | 0.90°C/W | Aluminum | - |
|
342945-COPPER SKIVFIN342945,REV03(GP) |
1,726 |
|
Datasheet | - | Bulk | Active | Board Level | BGA, FPGA | Push Pin, Thermal Material | Square, Fins | 2.362" (60.00mm) | 2.362" (60.00mm) | - | 0.551" (14.00mm) | - | - | - | Copper | - |
|
342947-COPPER SKIVFIN342947,REV02(GP) |
1,157 |
|
Datasheet | - | Bulk | Active | Board Level | BGA, FPGA | Push Pin, Thermal Material | Rectangular, Fins | 2.323" (59.00mm) | 2.280" (57.91mm) | - | 0.433" (11.00mm) | - | - | - | Copper | - |
|
1253805WX36" EXTRUSION 16414 XX7332 |
3,609 |
|
Datasheet | - | Box | Active | Top Mount, Extrusion | Power Modules | Adhesive | Rectangular, Fins | 36.000" (914.40mm) | 5.000" (127.00mm) | - | 1.500" (38.10mm) | - | - | 0.63°C/W | Aluminum | - |
|
342943-COPPER SKIVFIN342943 |
1,572 |
|
Datasheet | - | Bulk | Active | Board Level | BGA, FPGA | Push Pin, Thermal Material | Square, Fins | 1.969" (50.00mm) | 1.969" (50.00mm) | - | 0.551" (14.00mm) | - | - | - | Copper | - |
|
HSF-48-19-Y-FFANSINK 5VDC 47.5X47.5X18.5MM |
1,303 |
|
Datasheet | HSF | Bulk | Active | Top Mount | BGA | Clip | Square, Fins | 1.870" (47.50mm) | 1.870" (47.50mm) | - | 0.728" (18.50mm) | - | - | 1.41°C/W | Aluminum Alloy | Black Anodized |
|
HSF-48-19-B-FFANSINK 5VDC 47.5X47.5X18.5MM |
3,855 |
|
Datasheet | HSF | Bulk | Active | Top Mount | BGA | Clip | Square, Fins | 1.870" (47.50mm) | 1.870" (47.50mm) | - | 0.728" (18.50mm) | - | - | 1.41°C/W | Aluminum Alloy | Black Anodized |
|
KK0729-02TEHEATSPREADER FOR TE0729-02 |
1,802 |
|
Datasheet | TE0729 | Bulk | Obsolete | Heat Spreader | TE0729-02 | Bolt On | Rectangular | 2.992" (76.00mm) | 2.047" (52.00mm) | - | 0.354" (9.00mm) | - | - | - | - | - |
|
1254368.35WX12" EXTRUSION 13668 XX4937 |
4,035 |
|
Datasheet | - | Box | Active | Top Mount, Extrusion | - | Adhesive | Rectangular, Fins | 12.000" (304.80mm) | 8.350" (212.09mm) | - | 2.000" (50.80mm) | - | - | 0.23°C/W | Aluminum | - |
|
1254884.75X36" EXTRUSION 4530 XX1024 |
2,215 |
|
Datasheet | - | Box | Active | Board Level, Extrusion | - | Bolt On | Rectangular, Fins | 36.000" (914.40mm) | 4.750" (120.65mm) | - | 1.245" (31.62mm) | - | - | 0.50°C/W | Aluminum | - |
|
|
SF4P2U-F004-A01Intel Socket 2011 Series 145W 2U |
4,045 |
|
Datasheet | 2011 | Bulk | Active | Top Mount with Fan | Intel LGA2011 2U Active CPU Cooler | Push Pin | Rectangular, Fins | 3.524" (89.50mm) | 3.524" (89.50mm) | - | 2.519" (64.00mm) | 145.0W @ 25.1°C | - | 0.17°C/W | Aluminum, Copper | - |
|
KK0714-02HEATSPREADER FOR TE0714-02 |
2,460 |
|
Datasheet | TE0714 | Bulk | Discontinued at Digi-Key | Heat Spreader | TE0714-02 | Bolt On | Rectangular | 1.575" (40.00mm) | 1.181" (30.00mm) | - | 0.236" (6.00mm) | - | - | - | - | - |
|
1101ATHM,10761A REV --G |
3,195 |
|
Datasheet | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
SAR365ASX150MMEXTRUDED HEATSINK 216X150MM |
1,342 |
|
Datasheet | 365AS | Bulk | Active | Top Mount | - | Thermal Tape, Adhesive | Rectangular, Fins | 5.906" (150.00mm) | 8.504" (216.00mm) | - | 3.268" (83.00mm) | - | - | - | Aluminum | Natural Anodized |
|
HSF-55-35-B-FFANSINK 12VDC 55X55X35.1MM |
4,671 |
|
Datasheet | HSF | Bulk | Active | Top Mount | BGA | Clip | Square, Fins | 2.165" (55.00mm) | 2.165" (55.00mm) | - | 1.303" (33.10mm) | - | - | 0.59°C/W | Aluminum Alloy | Black Anodized |
|
476KHEATSINK MED HEXTYPE |
3,597 |
|
Datasheet | 476 | Bulk | Active | Board Level | Stud Mounted Diode | Bolt On | Rectangular, Fins | 6.000" (152.40mm) | 5.000" (127.00mm) | - | 5.000" (127.00mm) | 50.0W @ 25°C | 0.20°C/W @ 500 LFM | 0.50°C/W | Aluminum | Black Anodized |
|
HSET875-X-BHEATSINK WITH FAN FOR ET875-X7/ |
3,709 |
|
Datasheet | - | Box | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
V4511BPROFILE HEATSINK |
3,399 |
|
Datasheet | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
HSIB903-BGAAC, HEATSINK + FAN FOR IB903F/ I |
3,534 |
|
Datasheet | - | Box | Active | Top Mount | IB903F | - | - | - | - | - | - | - | - | - | - | - |
|
HSET875-1HEAT SPREADER FOR ET875-420/335 |
1,544 |
|
Datasheet | - | Box | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
Frequently Asked Questions
What are Heat Sinks components used for?
Heat Sinks components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right Heat Sinks part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can ICMENU help source obsolete or hard-to-find Heat Sinks parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. ICMENU will review your request and provide available stock, pricing and sourcing information.