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ELECTRONIC COMPONENTS

Heat Sinks

Explore Heat Sinks parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to ICMENU. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
507302B00000G Boyd Laconia, LLC

507302B00000G

HEATSINK TO-220 2.5W LOW PROFILE

Boyd Laconia, LLC

31,204
Datasheet - Bulk Active Board Level TO-220 Bolt On Square, Fins 0.750" (19.05mm) 0.750" (19.05mm) - 0.380" (9.65mm) 2.5W @ 60°C 10.00°C/W @ 200 LFM 24.00°C/W Aluminum Black Anodized
574502B00000G Boyd Laconia, LLC

574502B00000G

HEATSINK TO-220 VERT MNT .75"

Boyd Laconia, LLC

39,642
Datasheet - Bag Active Board Level TO-220 Clip Rectangular, Fins 0.750" (19.05mm) 0.860" (21.84mm) - 0.395" (10.03mm) 3.0W @ 60°C 8.00°C/W @ 400 LFM 21.20°C/W Aluminum Black Anodized
290-1AB Wakefield-Vette

290-1AB

HEATSINK TO-220 VERT/HORZ BLK

Wakefield-Vette

4,488
Datasheet 290 Bulk Active Board Level TO-218, TO-202, TO-220 Bolt On Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 2.0W @ 44°C 7.00°C/W @ 400 LFM 22.00°C/W Aluminum Black Anodized
V-1100-SMD/B-L Assmann WSW Components

V-1100-SMD/B-L

HEAT SINK COPPER DPAK TO-252

Assmann WSW Components

6,405
Datasheet - Bulk Active Top Mount TO-252 (DPak) SMD Pad Rectangular, Fins 0.320" (8.13mm) 0.790" (20.07mm) - 0.390" (9.91mm) - - 25.00°C/W Copper Tin
V-1100-SMD/A-L Assmann WSW Components

V-1100-SMD/A-L

HEATSINK TO-263 12.70X26.20MM

Assmann WSW Components

4,987
Datasheet - Bulk Active Top Mount TO-263 (D²Pak) SMD Pad Rectangular, Fins 0.500" (12.70mm) 1.031" (26.20mm) - 0.390" (9.91mm) - - 23.00°C/W Copper Tin
577102B04000G Boyd Laconia, LLC

577102B04000G

HEATSINK TO-220 W/TAB .375"

Boyd Laconia, LLC

21,002
Datasheet - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.375" (9.52mm) 1.0W @ 30°C 8.00°C/W @ 400 LFM 25.90°C/W Aluminum Black Anodized
V2017B Assmann WSW Components

V2017B

HEATSINK ANOD ALUM CPU

Assmann WSW Components

3,057
Datasheet - Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) - Square, Pin Fins 0.394" (10.00mm) 0.394" (10.00mm) - 0.275" (7.00mm) - - 31.00°C/W Aluminum Black Anodized
V6560W Assmann WSW Components

V6560W

HEATSINK ALUM ANOD

Assmann WSW Components

4,885
Datasheet - Tray Active Board Level TO-220 Bolt On and PC Pin Rectangular, Fins 0.984" (25.00mm) 1.181" (30.00mm) - 0.472" (12.00mm) - - 10.00°C/W Aluminum Black Anodized
V-1100-SMD/B Assmann WSW Components

V-1100-SMD/B

HEAT SINK COPPER DPAK TO-252

Assmann WSW Components

14,896
Datasheet - Tape & Reel (TR) Active Top Mount TO-252 (DPak) SMD Pad Rectangular, Fins 0.320" (8.13mm) 0.790" (20.07mm) - 0.390" (9.91mm) - - 25.00°C/W Copper Tin
287-1ABE Wakefield-Vette

287-1ABE

HEATSINK FOR TO220

Wakefield-Vette

3,947
Datasheet 287 Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - 0.500" (12.70mm) 4.0W @ 65°C 7.80°C/W @ 200 LFM 16.20°C/W Aluminum Black Anodized
577202B00000G Boyd Laconia, LLC

577202B00000G

HEAT SINK TO-220 .500" COMPACT

Boyd Laconia, LLC

11,197
Datasheet - Bag Active Board Level TO-220 Bolt On Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.500" (12.70mm) 1.5W @ 40°C 10.00°C/W @ 200 LFM 24.40°C/W Aluminum Black Anodized
576802B04000G Boyd Laconia, LLC

576802B04000G

HEAT SINK VERT PLUG-IN TO-220

Boyd Laconia, LLC

12,560
Datasheet - Bulk Active Board Level, Vertical TO-220, TO-262 Clip and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.500" (12.70mm) - 0.500" (12.70mm) 1.0W @ 30°C 7.00°C/W @ 400 LFM 27.30°C/W Aluminum Black Anodized
577102B00000G Boyd Laconia, LLC

577102B00000G

HEAT SINK TO-220 .375" COMPACT

Boyd Laconia, LLC

778
Datasheet - Bag Active Board Level TO-220 Bolt On Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.375" (9.52mm) 3.0W @ 80°C 12.00°C/W @ 200 LFM 25.90°C/W Aluminum Black Anodized
110991327 Seeed Technology Co., Ltd

110991327

HEAT SINK KIT FOR RASPBERRY PI 4

Seeed Technology Co., Ltd

22,678
Datasheet - Bulk Active Top Mount Kit Raspberry Pi 4B Adhesive - - - - - - - - Aluminum -
573300D00010G Boyd Laconia, LLC

573300D00010G

HEATSINK D2PAK .4" HIGH SMD

Boyd Laconia, LLC

21,954
Datasheet - Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) SMD Pad Rectangular, Fins 0.500" (12.70mm) 1.030" (26.16mm) - 0.400" (10.16mm) 1.3W @ 30°C 10.00°C/W @ 200 LFM 18.00°C/W Aluminum Tin
658-25AB Wakefield-Vette

658-25AB

HEATSINK CPU 28MM SQ BLK

Wakefield-Vette

10,734
Datasheet 658 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.250" (6.35mm) 2.0W @ 40°C 5.00°C/W @ 500 LFM - Aluminum Black Anodized
HSB05-171711 Same Sky (Formerly CUI Devices)

HSB05-171711

HEAT SINK, BGA, 17 X 17 X 11.5 M

Same Sky (Formerly CUI Devices)

6,249
Datasheet HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.669" (17.00mm) 0.669" (17.00mm) - 0.453" (11.50mm) 3.1W @ 75°C 8.40°C/W @ 200 LFM 23.91°C/W Aluminum Alloy Black Anodized
574502B03300G Boyd Laconia, LLC

574502B03300G

HEATSINK TO-220 VERT MNT W/TAB

Boyd Laconia, LLC

8,221
Datasheet - Bulk Active Board Level, Vertical TO-220 Clip and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.810" (20.57mm) - 0.390" (9.91mm) 3.0W @ 60°C 6.00°C/W @ 600 LFM 21.20°C/W Aluminum Black Anodized
658-60AB Wakefield-Vette

658-60AB

HEATSINK CPU 28MM SQ BLK W/OTAPE

Wakefield-Vette

133
Datasheet 658 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.598" (15.20mm) 2.5W @ 30°C 2.00°C/W @ 500 LFM - Aluminum Black Anodized
573100D00010G Boyd Laconia, LLC

573100D00010G

HEATSINK SMT D-PAK/TO-252 TIN

Boyd Laconia, LLC

11,190
Datasheet 5731 Tape & Reel (TR) Active Top Mount TO-252 (DPak) SMD Pad Rectangular, Fins 0.315" (8.00mm) 0.900" (22.86mm) - 0.400" (10.16mm) 0.8W @ 30°C 12.50°C/W @ 600 LFM 26.00°C/W Aluminum Tin
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FAQ

Frequently Asked Questions

What are Heat Sinks components used for?

Heat Sinks components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right Heat Sinks part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can ICMENU help source obsolete or hard-to-find Heat Sinks parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. ICMENU will review your request and provide available stock, pricing and sourcing information.

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