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ELECTRONIC COMPONENTS

Heat Sinks

Explore Heat Sinks parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to ICMENU. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
513102B02500G Boyd Laconia, LLC

513102B02500G

HEATSINK TO-220 W/PINS 1.5"TALL

Boyd Laconia, LLC

4,060
Datasheet - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.500" (38.10mm) 1.375" (34.93mm) - 0.500" (12.70mm) 8.0W @ 80°C 3.00°C/W @ 500 LFM 11.00°C/W Aluminum Black Anodized
3083 Adafruit Industries LLC

3083

ALUM HEAT SINK FOR RASPBERRY PI

Adafruit Industries LLC

2,534
Datasheet - Bulk Active Top Mount Raspberry Pi 3 Thermal Tape, Adhesive (Included) Square, Fins 0.551" (14.00mm) 0.551" (14.00mm) - 0.315" (8.00mm) - - - Aluminum -
LTN20069 Wakefield-Vette

LTN20069

HEAT SINK BGA/PGA 16.5X16.5X8.9

Wakefield-Vette

5,849
Datasheet Penguin Bulk Active Board Level Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Fins 0.650" (16.51mm) 0.653" (16.59mm) - 0.350" (8.89mm) - 8.00°C/W @ 500 LFM - Aluminum Black Anodized
513201B02500G Boyd Laconia, LLC

513201B02500G

HEATSINK TO-218/TO-247 W/PINS 2"

Boyd Laconia, LLC

1,697
Datasheet - Bulk Active Board Level, Vertical TO-218 Bolt On and PC Pin Rectangular, Fins 2.000" (50.80mm) 1.375" (34.93mm) - 0.500" (12.70mm) 2.0W @ 20°C 3.00°C/W @ 400 LFM 8.30°C/W Aluminum Black Anodized
637-10ABPE Wakefield-Vette

637-10ABPE

HEATSINK TO-220 VERT MT BLK 1"

Wakefield-Vette

2,170
Datasheet 637 Box Active Board Level, Vertical TO-220 Bolt On and Board Mounts Rectangular, Fins 1.000" (25.40mm) 1.375" (34.93mm) - 0.500" (12.70mm) 6.0W @ 76°C 5.80°C/W @ 200 LFM - Aluminum Black Anodized
V-1102-SMD/A-L Assmann WSW Components

V-1102-SMD/A-L

HEATSINK TO-263 19.38X25.40MM

Assmann WSW Components

4,655
Datasheet - Bulk Active Top Mount TO-263 (D²Pak) SMD Pad Rectangular, Fins 0.763" (19.38mm) 1.000" (25.40mm) - 0.450" (11.43mm) - 23.00°C/W @ 300 LFM 11.00°C/W Copper Tin
DV-T263-201E-TR Ohmite

DV-T263-201E-TR

HEATSINK FOR TO-263

Ohmite

10,676
Datasheet D Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) Solderable Feet Rectangular, Fins 0.500" (12.70mm) 1.020" (25.91mm) - 0.480" (12.19mm) 2.0W @ 30°C 8.00°C/W @ 500 LFM - Aluminum Degreased
6025DG Boyd Laconia, LLC

6025DG

HEATSINK TO-220 STAGGEREDFIN TIN

Boyd Laconia, LLC

8,081
Datasheet - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.250" (31.75mm) 0.875" (22.23mm) - 0.250" (6.35mm) 3.0W @ 60°C 7.00°C/W @ 400 LFM 17.90°C/W Copper Tin
TGH-0075-01 t-Global Technology

TGH-0075-01

ALUMINIUM HEAT SINK 7.5X7.5MM

t-Global Technology

747
Datasheet TGH Bulk Active Top Mount - - Square, Fins 0.295" (7.50mm) 0.295" (7.50mm) - 0.394" (10.00mm) - - - Aluminum Clean Anodized
V5618A Assmann WSW Components

V5618A

HEATSINK ALUM ANOD

Assmann WSW Components

24,969
Datasheet - Bulk Active Top Mount 6-Dip and 8-Dip Press Fit Rectangular, Fins 0.334" (8.50mm) 0.250" (6.35mm) - 0.189" (4.80mm) - - 80.00°C/W Aluminum Black Anodized
375424B00034G Boyd Laconia, LLC

375424B00034G

HEATSINK PIN-FIN W/TAPE

Boyd Laconia, LLC

2,277
Datasheet - Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.598" (15.19mm) 0.598" (15.19mm) - 0.252" (6.40mm) - 17.60°C/W @ 200 LFM 62.50°C/W Aluminum Black Anodized
3082 Adafruit Industries LLC

3082

ALUM HEATSINK FOR RASPBERRY PI

Adafruit Industries LLC

1,139
Datasheet - Bulk Active Top Mount Raspberry Pi 3 Thermal Tape, Adhesive (Included) Square, Fins 0.591" (15.00mm) 0.591" (15.00mm) - 0.590" (15.00mm) - - - Aluminum -
110991328 Seeed Technology Co., Ltd

110991328

HEAT SINK KIT FOR RASPBERRY PI 4

Seeed Technology Co., Ltd

2,602
Datasheet - Bulk Active Top Mount Kit Raspberry Pi 4B Adhesive - - - - - - - - Aluminum -
374024B00035G Boyd Laconia, LLC

374024B00035G

HEATSINK BGA 23X23X10MM W/ADH

Boyd Laconia, LLC

1,892
Datasheet - Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.906" (23.01mm) 0.906" (23.01mm) - 0.394" (10.00mm) 1.0W @ 40°C 11.70°C/W @ 200 LFM 40.00°C/W Aluminum Black Anodized
529702B02500G Boyd Laconia, LLC

529702B02500G

BOARD LEVEL HEATSINK 1" TO-220

Boyd Laconia, LLC

2,157
Datasheet - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.000" (25.40mm) 4.0W @ 30°C 4.00°C/W @ 200 LFM 5.50°C/W Aluminum Black Anodized
657-20ABEP Wakefield-Vette

657-20ABEP

HEATSINK TO-220 W/PINS BLK 2"

Wakefield-Vette

9,777
Datasheet 657 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 2.000" (50.80mm) 6.0W @ 32°C 2.90°C/W @ 200 LFM 5.30°C/W Aluminum Black Anodized
647-15ABPE Wakefield-Vette

647-15ABPE

HEATSINK TO-220 W/PINS BLK 1.5"

Wakefield-Vette

3,550
Datasheet 647 Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.500" (38.10mm) 1.650" (41.91mm) - 1.000" (25.40mm) 6.0W @ 37°C 3.50°C/W @ 200 LFM - Aluminum Black Anodized
7109D/TRG Boyd Laconia, LLC

7109D/TRG

HEATSINK TO-263 (D2PK)

Boyd Laconia, LLC

9,031
Datasheet - Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) SMD Pad Rectangular, Fins 0.763" (19.38mm) 1.000" (25.40mm) - 0.450" (11.43mm) 2.0W @ 30°C 3.00°C/W @ 300 LFM 11.00°C/W Copper Tin
624-25ABT4E Wakefield-Vette

624-25ABT4E

HEATSINK CPU 21MM SQ W/DBL TAPE

Wakefield-Vette

1,017
Datasheet 624 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.250" (6.35mm) - 25.00°C/W @ 200 LFM - Aluminum Black Anodized
DV-T263-101E-TR Ohmite

DV-T263-101E-TR

TO-263 HEAT SINK / POLY TAPE

Ohmite

2,480
Datasheet D Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) Solderable Feet Rectangular, Fins 0.500" (12.70mm) 1.020" (25.91mm) - 0.400" (10.16mm) 2.0W @ 30°C 8.00°C/W @ 500 LFM - Aluminum Degreased
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FAQ

Frequently Asked Questions

What are Heat Sinks components used for?

Heat Sinks components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right Heat Sinks part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can ICMENU help source obsolete or hard-to-find Heat Sinks parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

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