Heat Sinks
Review Heat Sinks Thermal components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.
If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to ICMENU for sourcing and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Package Cooled | Attachment Method | Shape | Length | Width | Diameter | Fin Height | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material | Material Finish |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
BDN10-5CB/A01HEATSINK CPU W/ADHESIVE 1.01"SQ |
1,540 |
|
Datasheet | BDN | Tray | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 1.010" (25.65mm) | 1.010" (25.65mm) | - | 0.555" (14.10mm) | - | 6.30°C/W @ 400 LFM | 20.80°C/W | Aluminum | Black Anodized |
|
BDN12-3CB/A01HEATSINK CPU W/ADHESIVE 1.21"SQ |
1,239 |
|
Datasheet | BDN | Tray | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 1.210" (30.73mm) | 1.210" (30.73mm) | - | 0.355" (9.02mm) | - | 6.80°C/W @ 400 LFM | 19.60°C/W | Aluminum | Black Anodized |
|
BDN15-3CB/A01HEATSINK CPU W/ADHESIVE 1.51"SQ |
2,352 |
|
Datasheet | BDN | Tray | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 1.510" (38.35mm) | 1.510" (38.35mm) | - | 0.355" (9.02mm) | - | 4.50°C/W @ 400 LFM | 15.10°C/W | Aluminum | Black Anodized |
|
BDN17-3CB/A01HEATSINK CPU W/ADHESIVE 1.71"SQ |
2,862 |
|
Datasheet | BDN | Tray | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 1.710" (43.43mm) | 1.710" (43.43mm) | - | 0.355" (9.02mm) | - | 3.80°C/W @ 400 LFM | 11.50°C/W | Aluminum | Black Anodized |
|
APF19-19-06CBHEATSINK LOW-PROFILE FORGED |
1,288 |
|
Datasheet | APF | Box | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Not Included) | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | 0.250" (6.35mm) | - | 7.10°C/W @ 200 LFM | - | Aluminum | Black Anodized |
|
BDN16-3CB/A01HEATSINK CPU W/ADHESIVE 1.61"SQ |
4,486 |
|
Datasheet | BDN | Tray | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 1.610" (40.89mm) | 1.610" (40.89mm) | - | 0.355" (9.02mm) | - | 4.50°C/W @ 400 LFM | 13.50°C/W | Aluminum | Black Anodized |
|
AER19-19-12CB/A01HEATSINK FORGED BLK ANO TOP MNT |
4,532 |
|
Datasheet | AER | Tray | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | Square, Fins | 0.732" (18.60mm) | 0.732" (18.60mm) | - | 0.457" (11.60mm) | - | 6.42°C/W @ 200 LFM | 15.85°C/W | Aluminum Alloy | Black Anodized |
|
|
AER19-19-15CB/A01HEATSINK FORGED BLK ANO TOP MNT |
2,607 |
|
Datasheet | AER | Tray | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | Square, Fins | 0.732" (18.60mm) | 0.732" (18.60mm) | - | 0.575" (14.60mm) | - | 5.92°C/W @ 200 LFM | 15.45°C/W | Aluminum Alloy | Black Anodized |
|
|
AER19-19-18CB/A01HEATSINK FORGED BLK ANO TOP MNT |
2,437 |
|
Datasheet | AER | Tray | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | Square, Fins | 0.732" (18.60mm) | 0.732" (18.60mm) | - | 0.693" (17.60mm) | - | 5.52°C/W @ 200 LFM | 14.95°C/W | Aluminum Alloy | Black Anodized |
|
AER21-21-12CB/A01HEATSINK FORGED BLK ANO TOP MNT |
3,570 |
|
Datasheet | AER | Tray | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | Square, Fins | 0.811" (20.60mm) | 0.811" (20.60mm) | - | 0.457" (11.60mm) | - | 5.62°C/W @ 200 LFM | 15.10°C/W | Aluminum Alloy | Black Anodized |
Frequently Asked Questions
What are Heat Sinks components used for?
Heat Sinks components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right Heat Sinks part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can ICMENU help source obsolete or hard-to-find Heat Sinks parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. ICMENU will review your request and provide available stock, pricing and sourcing information.