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ELECTRONIC COMPONENTS

Heat Sinks

Explore Heat Sinks parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to ICMENU. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
KU-0334-AL-ST-1,2MM-3-A-VE-SG Boyd Laconia, LLC

KU-0334-AL-ST-1,2MM-3-A-VE-SG

KU-0334-AL-ST-1,2MM-3-A-VE-SG

Boyd Laconia, LLC

1,405
Datasheet - Bulk Active - - - - - - - - - - - - -
342941-COPPER SKIVFIN Boyd Laconia, LLC

342941-COPPER SKIVFIN

342941,REV04(GP)

Boyd Laconia, LLC

2,417
Datasheet - Bulk Active Board Level BGA, FPGA Push Pin, Thermal Material Rectangular, Fins 1.594" (40.50mm) 1.575" (40.00mm) - 0.531" (13.50mm) - - - Copper -
6296BG PINS Boyd Laconia, LLC

6296BG PINS

HTSK-AL-16372-25.4-B-PINS-(ML97/

Boyd Laconia, LLC

2,872
Datasheet - Bulk Active Board Level, Vertical TO-218, TO-220 Bolt On and PC Pin Rectangular, Fins 1.650" (41.91mm) 0.992" (25.20mm) - 1.000" (25.40mm) - - 5.23°C/W Aluminum Black Anodized
530862B05162/MOD.HOLEG Boyd Laconia, LLC

530862B05162/MOD.HOLEG

202337-0002 REV B

Boyd Laconia, LLC

2,109
Datasheet - Bulk Active - - - - - - - - - - - - -
10-6327-01G + T725 PAD Boyd Laconia, LLC

10-6327-01G + T725 PAD

10-6327-01G + T725 PAD

Boyd Laconia, LLC

4,929
Datasheet - Bulk Active Board Level BGA, FPGA Push Pin Square, Pin Fins 1.122" (28.50mm) 1.122" (28.50mm) - 0.394" (10.00mm) 1.0W @ 30°C 8.00°C/W @ 300 LFM - Aluminum Black Anodized
66100-2167 Boyd Laconia, LLC

66100-2167

HEAT SINK(RD002371)66100-2167 RE

Boyd Laconia, LLC

1,318
Datasheet - Bulk Active - - - - - - - - - - - - -
371924B00034G Boyd Laconia, LLC

371924B00034G

H/S ASS'Y 35*35*13.97MM PGA,3719

Boyd Laconia, LLC

2,805
Datasheet - Bulk Active Top Mount BGA, FPGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.550" (13.97mm) 3.0W @ 60°C 4.00°C/W @ 300 LFM - Aluminum Black Anodized
3293-1 Boyd Laconia, LLC

3293-1

3293-2,REV A(GP)

Boyd Laconia, LLC

1,072
Datasheet - Bulk Active - - - - - - - - - - - - -
SW25-4G Boyd Laconia, LLC

SW25-4G

THM,ZA3288 ISS 5 SW25-4

Boyd Laconia, LLC

3,945
Datasheet - Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 0.492" (12.50mm) 1.359" (34.50mm) - 0.984" (25.00mm) 2.0W @ 30°C 6.50°C/W @ 200 LFM 11.40°C/W Aluminum Black Anodized
476400U00000G Boyd Laconia, LLC

476400U00000G

BFIN,476400U00000G

Boyd Laconia, LLC

3,509
Datasheet - Bulk Active - - - - - - - - - - - - -
342949-COPPER SKIVFIN Boyd Laconia, LLC

342949-COPPER SKIVFIN

342949

Boyd Laconia, LLC

4,709
Datasheet - Bulk Active Board Level BGA, FPGA Push Pin, Thermal Material Square, Fins 3.150" (80.00mm) 3.150" (80.00mm) - 0.472" (12.00mm) - - - Copper -
6032B-TTG Boyd Laconia, LLC

6032B-TTG

THM,10824B-TT REV U(COPPER)G

Boyd Laconia, LLC

4,021
Datasheet - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.380" (35.05mm) 0.500" (12.70mm) - 2.000" (50.80mm) 2.0W @ 30°C 5.00°C/W @ 200 LFM - Copper Black Anodized
KU-SBK-0451-ES-ST-0,7MM-SG Boyd Laconia, LLC

KU-SBK-0451-ES-ST-0,7MM-SG

KU-SBK-0451-ES-ST-0,7MM-SG

Boyd Laconia, LLC

4,978
Datasheet - Bulk Active - - - - - - - - - - - - -
TV35G Boyd Laconia, LLC

TV35G

HTSK-AL-TV35-B-@-(TV35G ZA1609

Boyd Laconia, LLC

3,829
Datasheet - Bulk Active Board Level TO-220 Clip and PC Pin Rectangular, Fins 1.496" (38.00mm) 1.654" (42.00mm) - 0.984" (25.00mm) 3.0W @ 20°C 5.00°C/W @ 200 LFM 7.20°C/W Aluminum Black Anodized
374424B00000G Boyd Laconia, LLC

374424B00000G

374424B00000G HS (GP)

Boyd Laconia, LLC

3,210
Datasheet - Bulk Active - - - - - - - - - - - - -
241404B91203G Boyd Laconia, LLC

241404B91203G

FG,241404B91203G,REV 01(GP)

Boyd Laconia, LLC

3,563
Datasheet - Bulk Active - - - - - - - - - - - - -
7022B-TC11-MTG Boyd Laconia, LLC

7022B-TC11-MTG

THM,7022B-TC11-MTG

Boyd Laconia, LLC

3,185
Datasheet - Bulk Active Board Level, Vertical TO-220 Clip and PC Pin, Bolt On Rectangular, Fins 1.986" (50.44mm) 0.375" (9.53mm) - 1.968" (49.99mm) 10.0W @ 70°C 3.00°C/W @ 400 LFM 6.50°C/W Aluminum Black Anodized
10-6327-01,MOD EARS Boyd Laconia, LLC

10-6327-01,MOD EARS

10-6327-01 MOD EARS,REV 00,00,04

Boyd Laconia, LLC

4,237
Datasheet - Bulk Active Top Mount BGA Push Pin Square, Pin Fins 1.122" (28.50mm) 1.122" (28.50mm) - 0.394" (10.00mm) - 9.26°C/W @ 200 LFM 30.60°C/W Aluminum Black Anodized
2288BG Boyd Laconia, LLC

2288BG

2288BG

Boyd Laconia, LLC

2,629
Datasheet - Bulk Active Board Level BGA Thermal Tape, Adhesive (Not Included) Cylindrical - - 0.300" (7.62mm) ID, 1.000" (25.40mm) OD - 1.5W @ 40°C 8.00°C/W @ 400 LFM - - -
KU-SBK-0383-ES-ST-0,3MM-SG Boyd Laconia, LLC

KU-SBK-0383-ES-ST-0,3MM-SG

KU-SBK-0383-ES-ST-0,3MM-SG

Boyd Laconia, LLC

3,436
Datasheet - Bulk Active - - - - - - - - - - - - -
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FAQ

Frequently Asked Questions

What are Heat Sinks components used for?

Heat Sinks components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right Heat Sinks part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can ICMENU help source obsolete or hard-to-find Heat Sinks parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. ICMENU will review your request and provide available stock, pricing and sourcing information.

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