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FILTERED COMPONENT SELECTION

Heat Sinks

Review Heat Sinks Thermal components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.

If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to ICMENU for sourcing and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
HSB18-232310 Same Sky (Formerly CUI Devices)

HSB18-232310

HEAT SINK, BGA, 23 X 23 X 10 MM

Same Sky (Formerly CUI Devices)

4,224
Datasheet HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.906" (23.00mm) 0.906" (23.00mm) - 0.394" (10.00mm) 3.7W @ 75°C 6.80°C/W @ 200 LFM 20.41°C/W Aluminum Alloy Black Anodized
HSE-B20250-040H-01 Same Sky (Formerly CUI Devices)

HSE-B20250-040H-01

HEAT SINK, EXTRUSION, TO-220, 25

Same Sky (Formerly CUI Devices)

1,145
Datasheet HSE Box Active Board Level, Vertical TO-220 PC Pin Rectangular, Angled Fins 0.984" (25.00mm) 1.359" (34.50mm) - 0.492" (12.50mm) 5.5W @ 75°C 4.44°C/W @ 200 LFM 13.64°C/W Aluminum Alloy Black Anodized
HSB08-212106 Same Sky (Formerly CUI Devices)

HSB08-212106

HEAT SINK, BGA, 21 X 21 X 6 MM

Same Sky (Formerly CUI Devices)

1,436
Datasheet HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.236" (6.00mm) 3.0W @ 75°C 9.70°C/W @ 200 LFM 25.40°C/W Aluminum Alloy Black Anodized
HSB12-272706 Same Sky (Formerly CUI Devices)

HSB12-272706

HEAT SINK, BGA, 27 X 27 X 6 MM

Same Sky (Formerly CUI Devices)

1,101
Datasheet HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.236" (6.00mm) 3.8W @ 75°C 7.80°C/W @ 200 LFM 19.59°C/W Aluminum Alloy Black Anodized
HSB03-121218 Same Sky (Formerly CUI Devices)

HSB03-121218

HEAT SINK, BGA, 12 X 12 X 18 MM

Same Sky (Formerly CUI Devices)

1,500
Datasheet HSB Tray Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.472" (12.00mm) 0.472" (12.00mm) - 0.709" (18.00mm) 3.1W @ 75°C 9.60°C/W @ 200 LFM 24.01°C/W Aluminum Alloy Black Anodized
HSB09-212115 Same Sky (Formerly CUI Devices)

HSB09-212115

HEAT SINK, BGA, 21 X 21 X 15 MM

Same Sky (Formerly CUI Devices)

2,583
Datasheet HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.591" (15.00mm) 4.3W @ 75°C 6.00°C/W @ 200 LFM 17.39°C/W Aluminum Alloy Black Anodized
HSS24-B20-NP Same Sky (Formerly CUI Devices)

HSS24-B20-NP

HEAT SINK, STAMPING, TO-218/TO-2

Same Sky (Formerly CUI Devices)

2,779
Datasheet HSS Box Active Top Mount TO-218, TO-220 Bolt On Rectangular, Fins 1.654" (42.00mm) 1.496" (38.00mm) - 0.984" (25.00mm) 7.85W @ 75°C 4.30°C/W @ 200 LFM 9.56°C/W Aluminum Alloy Black Anodized
HSE-B20350-NP Same Sky (Formerly CUI Devices)

HSE-B20350-NP

HEAT SINK, EXTRUSION, TO-220, 35

Same Sky (Formerly CUI Devices)

1,436
Datasheet HSE Tray Active Board Level TO-220 Bolt On Rectangular, Fins 1.378" (35.00mm) 1.142" (29.00mm) - 0.472" (12.00mm) 6.2W @ 75°C 2.91°C/W @ 200 LFM 12.10°C/W Aluminum Alloy Black Anodized
HSE-B20380-040H Same Sky (Formerly CUI Devices)

HSE-B20380-040H

HEAT SINK, EXTRUSION, TO-220, 38

Same Sky (Formerly CUI Devices)

1,254
Datasheet HSE Tray Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Angled Fins 1.496" (38.00mm) 1.378" (35.00mm) - 0.492" (12.50mm) 7.4W @ 75°C 3.94°C/W @ 200 LFM 10.14°C/W Aluminum Alloy Black Anodized
HSB06-181810 Same Sky (Formerly CUI Devices)

HSB06-181810

HEAT SINK, BGA, 18 X 18 X 10 MM

Same Sky (Formerly CUI Devices)

1,111
Datasheet HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.709" (18.00mm) 0.709" (18.00mm) - 0.394" (10.00mm) 3.2W @ 75°C 18.80°C/W @ 200 LFM 23.68°C/W Aluminum Alloy Black Anodized
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FAQ

Frequently Asked Questions

What are Heat Sinks components used for?

Heat Sinks components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right Heat Sinks part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can ICMENU help source obsolete or hard-to-find Heat Sinks parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. ICMENU will review your request and provide available stock, pricing and sourcing information.

PART MATCHING & SOURCING

Need Help Narrowing Down the Right Heat Sinks Part?

Send your target specifications, preferred manufacturer, quantity or reference part number. Our team can help check matching options, availability and quotation details for your sourcing requirement.

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