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ELECTRONIC COMPONENTS

Heat Sinks

Explore Heat Sinks parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to ICMENU. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
658-35AB Wakefield-Vette

658-35AB

HEATSINK CPU 28MM SQBLK W/O TAPE

Wakefield-Vette

13,852
Datasheet 658 Tray Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.350" (8.89mm) - 3.00°C/W @ 800 LFM - Aluminum Black Anodized
V2268E1 Assmann WSW Components

V2268E1

CPU HEATSINK, CROSS CUT, AL6063,

Assmann WSW Components

1,929
Datasheet - Bulk Active Top Mount - Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.669" (17.00mm) 0.669" (17.00mm) - 0.236" (6.00mm) - - 30.00°C/W Aluminum Alloy Black Anodized
HSE-B20254-040H Same Sky (Formerly CUI Devices)

HSE-B20254-040H

HEAT SINK, EXTRUSION, TO-220, 25

Same Sky (Formerly CUI Devices)

2,107
Datasheet HSE Bag Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.260" (32.00mm) - 0.551" (14.00mm) 5.7W @ 75°C 7.74°C/W @ 200 LFM 13.16°C/W Aluminum Alloy Black Anodized
HSE-B20250-045H Same Sky (Formerly CUI Devices)

HSE-B20250-045H

HEAT SINK, EXTRUSION, TO-220, 50

Same Sky (Formerly CUI Devices)

868
Datasheet HSE Box Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.969" (50.00mm) 1.181" (30.00mm) - 0.472" (12.00mm) 7.7W @ 75°C 4.05°C/W @ 200 LFM 9.74°C/W Aluminum Alloy Black Anodized
V2269E1 Assmann WSW Components

V2269E1

CPU HEATSINK, CROSS CUT, AL6063,

Assmann WSW Components

1,083
Datasheet - Bulk Active Top Mount - Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.787" (20.00mm) 0.787" (20.00mm) - 0.354" (9.00mm) - - 27.00°C/W Aluminum Alloy Black Anodized
576802B03900G Boyd Laconia, LLC

576802B03900G

HEATSINK TO220 CLIPON W/TAB.75"

Boyd Laconia, LLC

15,144
Datasheet - Bulk Active Board Level, Vertical TO-220, TO-262 Clip and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.500" (12.70mm) - 0.500" (12.70mm) 1.0W @ 30°C 7.00°C/W @ 400 LFM 27.30°C/W Aluminum Black Anodized
7142DG Boyd Laconia, LLC

7142DG

HEATSINK TO-220 TIN CLIP-ON 21MM

Boyd Laconia, LLC

4,435
Datasheet - Bulk Active Board Level TO-220 Clip and Board Locks Rectangular, Fins 0.780" (19.81mm) 0.520" (13.21mm) - 0.515" (13.08mm) 1.0W @ 30°C 8.00°C/W @ 400 LFM 20.30°C/W Copper Tin
HSB26-343408 Same Sky (Formerly CUI Devices)

HSB26-343408

HEAT SINK, BGA, 33.5 X 33.5 X 8

Same Sky (Formerly CUI Devices)

524
Datasheet HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 1.319" (33.50mm) 1.319" (33.50mm) - 0.315" (8.00mm) 4.94W @ 75°C 5.30°C/W @ 200 LFM 15.19°C/W Aluminum Alloy Black Anodized
7173DG Boyd Laconia, LLC

7173DG

BOARD LEVEL HEATSINK .375"TO-220

Boyd Laconia, LLC

5,532
Datasheet - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.750" (19.05mm) - 0.375" (9.52mm) 1.5W @ 50°C 10.00°C/W @ 200 LFM 25.80°C/W Copper Tin
658-45AB Wakefield-Vette

658-45AB

HEATSINK CPU 28MM SQBLK W/O TAPE

Wakefield-Vette

2,642
Datasheet 658 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - 0.450" (11.43mm) 3.0W @ 50°C 6.00°C/W @ 200 LFM - Aluminum Black Anodized
HSE-B250-04H Same Sky (Formerly CUI Devices)

HSE-B250-04H

HEAT SINK, EXTRUSION, TO-220, 25

Same Sky (Formerly CUI Devices)

2,215
Datasheet HSE Box Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 0.984" (25.00mm) 1.378" (35.00mm) - 1.000" (25.40mm) 8.0W @ 75°C 3.26°C/W @ 200 LFM 13.60°C/W Aluminum Alloy Black Anodized
HSE-B20500-040H Same Sky (Formerly CUI Devices)

HSE-B20500-040H

HEAT SINK, EXTRUSION, TO-220, 50

Same Sky (Formerly CUI Devices)

727
Datasheet HSE Tray Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Angled Fins 1.969" (50.00mm) 1.378" (35.00mm) - 0.492" (12.50mm) 8.9W @ 75°C 4.85°C/W @ 200 LFM 8.43°C/W Aluminum Alloy Black Anodized
574902B03300G Boyd Laconia, LLC

574902B03300G

HEATSINK TO-220 VERT MNT W/TAB

Boyd Laconia, LLC

5,561
Datasheet - Bulk Active Board Level, Vertical TO-220 Clip and PC Pin Rectangular 1.375" (34.93mm) 0.860" (21.84mm) - 0.395" (10.03mm) 2.5W @ 40°C 6.00°C/W @ 400 LFM 16.00°C/W Aluminum Black Anodized
651-B Wakefield-Vette

651-B

HEATSINK 14-16PIN DIP BLK

Wakefield-Vette

1,025
Datasheet 651 Bulk Active Top Mount 14-DIP and 16-DIP Thermal Tape, Adhesive (Not Included) Rectangular, Fins 0.750" (19.05mm) 0.415" (10.54mm) - 0.240" (6.10mm) 0.5W @ 40°C 40.00°C/W @ 300 LFM - Aluminum Black Anodized
V5619B Assmann WSW Components

V5619B

HEATSINK ALUM ANOD

Assmann WSW Components

3,025
Datasheet - Bulk Active Top Mount 24-DIP Press Fit Rectangular, Fins 1.299" (32.99mm) 0.748" (19.00mm) - 0.189" (4.80mm) - - 48.00°C/W Aluminum Black Anodized
ATS-PCB1029 Advanced Thermal Solutions Inc.

ATS-PCB1029

HEATSINK TO-220 BLACK

Advanced Thermal Solutions Inc.

6,605
Datasheet - Bulk Active Board Level TO-220 Bolt On Rectangular, Fins 1.000" (25.40mm) 1.551" (39.40mm) - 0.374" (9.50mm) - 6.80°C/W @ 200 LFM 11.00°C/W Aluminum Black Anodized
V8813Y Assmann WSW Components

V8813Y

HEATSINK TO-220/TOP-3/SOT-32

Assmann WSW Components

399
Datasheet - Tray Active Board Level, Vertical SOT-32, TO-220, TOP-3 Bolt On and PC Pin Rectangular, Fins 1.969" (50.00mm) 1.359" (34.50mm) - 0.492" (12.50mm) - - 8.80°C/W Aluminum Black Anodized
HSB11-252518 Same Sky (Formerly CUI Devices)

HSB11-252518

HEAT SINK, BGA, 25 X 25 X 18 MM

Same Sky (Formerly CUI Devices)

2,722
Datasheet HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.709" (18.00mm) 5.5W @ 75°C 4.50°C/W @ 200 LFM 13.70°C/W Aluminum Alloy Black Anodized
XL25W-12-12-10 t-Global Technology

XL25W-12-12-10

CERAMIC HEAT SINK 12X12X10MM WHI

t-Global Technology

2,324
Datasheet XL-25 Bulk Active Heat Spreader Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape Square 0.472" (12.00mm) 0.472" (12.00mm) - 0.394" (10.00mm) - - - Ceramic -
657-15ABPEN Wakefield-Vette

657-15ABPEN

HEATSINK TO-220 W/PINS BLK 1.5"

Wakefield-Vette

2,871
Datasheet 657 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.500" (38.10mm) 6.0W @ 38°C 3.30°C/W @ 200 LFM - Aluminum Black Anodized
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FAQ

Frequently Asked Questions

What are Heat Sinks components used for?

Heat Sinks components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right Heat Sinks part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can ICMENU help source obsolete or hard-to-find Heat Sinks parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

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