Solder
Explore Solder parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to ICMENU. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMD291SNL250T4SLDR PST NO-CLEAN SAC305 T4 250G |
2,179 |
|
Datasheet | - | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD4300SNL250T4SLDR PST WATR SOL SAC305 T4 250G |
1,088 |
|
Datasheet | CHIPQUIK® SMD4300 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
TS391SNL250THERMALLY STABLE SOLDER PASTE NO |
2,114 |
|
Datasheet | - | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
SMDLTLFP250T3SOLDER PASTE SN42/BI58 250G |
1,142 |
|
Datasheet | - | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 3 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMDLTLFP250T4SOLDER PASTE LOW TEMP T4 250G |
3,453 |
|
Datasheet | - | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
TS391LT250THERMALLY STABLE SOLDER PASTE NO |
2,489 |
|
Datasheet | - | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
NCSWLF.031 1LBLF SOLDER WIRE 96.5/3/0.5 TIN/SI |
3,265 |
|
Datasheet | - | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
24-6337-6401SOLDER WATER SOLUABLE 24AWG 1LB |
3,588 |
|
Datasheet | 331 | Spool | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | Water Soluble | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
SMD291AX250T5SOLDER PASTE SN63/PB37 250G T5 |
1,619 |
|
Datasheet | - | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
24-6040-9713SOLDER FLUX-CORED/285 .031" 1LB |
1,008 |
|
Datasheet | 285 | Bulk | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031" (0.79mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
SMD4300AX250T5SOLDER PASTE SN63/PB37 250G T5 |
3,403 |
|
Datasheet | CHIPQUIK® SMD4300 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean, Water Soluble | - | 5 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
91-7482-3340INNOLOT 2.2%/278 .040 250 G ROBO |
3,501 |
|
Datasheet | - | Box | Active | Wire Solder | - | 0.040" (1.02mm) | - | No-Clean | - | - | Lead Free | Spool | - | - | - |
|
24-6040-0010SOLDER RA 60/40 24AWG 1LB |
1,865 |
|
Datasheet | 44 | Spool | Active | Wire Solder | Sn60Pb40 (60/40) | 0.020" (0.51mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
SMD291SNL250T5SOLDER PASTE SAC305 250G T5 |
1,001 |
|
Datasheet | - | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
WS991SNL500T4SOLDER PASTE THERMALLY STABLE WS |
4,309 |
|
Datasheet | CHIPQUIK® | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | Water Soluble | - | 4 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | - |
|
TS991SNL500T4SOLDER PASTE THERMALLY STABLE NC |
3,585 |
|
Datasheet | CHIPQUIK® | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | 4 | Lead Free | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture | - |
|
70-4825-0904NP560 SN96.5AG3.0CU0.5 T4 100 GM |
2,351 |
|
Datasheet | NP560 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 4 | Lead Free | Syringe, 3.53 oz (100g) | 12 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
24-7150-8800SOLDER FLUX-CORED/245 .031" 1LB |
4,416 |
|
Datasheet | 245 | Bulk | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
70-1002-0510SOLDER 500G JAR, SN63/PB37 |
2,598 |
|
Datasheet | HydroMark 531 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
1993881LOCTITEGC10SAC305T4 885 52U 500g |
4,511 |
|
Datasheet | LOCTITE® GC 10 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | - | Lead Free | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture | 41°F ~ 77°F (5°C ~ 25°C) |
Frequently Asked Questions
What are Solder components used for?
Solder components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right Solder part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can ICMENU help source obsolete or hard-to-find Solder parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. ICMENU will review your request and provide available stock, pricing and sourcing information.