Solder
Explore Solder parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to ICMENU. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
WC96L2031ESAC 305 NO CLEAN 8 OZ .031 DIA. |
2,005 |
|
Datasheet | - | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 20 AWG, 22 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
RCBLF22701062PBLF 227 ROSIN FLUX 1 LB. 062 DIA |
2,923 |
|
Datasheet | - | Spool | Active | Wire Solder | BLF 227 (99.17Sn/.8Cu/.03Ni) | 0.062" (1.57mm) | 440°F (227°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
RC96L2020CQPJSAC 305 ROSIN FLUX 8 OZ. .020 DI |
3,604 |
|
Datasheet | - | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
SW SN63 .062 1#SN63PB37 .062 DIA 1 lb. Spool |
100 |
|
Datasheet | - | Tape & Box (TB) | Active | Wire Solder | Sn63Pb37 (63/37) | 0.062" (1.57mm) | 361°F (183°C) | - | 14 AWG | - | Leaded | Spool, 1 lb (454 g) | - | Date of Manufacture | Room Temperature |
|
CCBLF22701031PBLF 227 NO CLEAN FLUX 1 LB. 031D |
4,250 |
|
Datasheet | - | Spool | Active | Wire Solder | BLF 227 (99.17Sn/.8Cu/.03Ni) | 0.031" (0.79mm) | 440°F (227°C) | No-Clean | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
RCBLF22701031PBLF 227 ROSIN FLUX 1 LB. 031DIA |
1,440 |
|
Datasheet | - | Spool | Active | Wire Solder | BLF 227 (99.17Sn/.8Cu/.03Ni) | 0.031" (0.79mm) | 440°F (227°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
JPAGSC0501PSIL CAN 5 BRAZING ALLOY |
1,449 |
|
Datasheet | - | Tube | Active | Brazing Rod | 5% Ag 89% Cu, 6% Phos | - | 1190/1495°F (1190/1495°F) | - | - | - | Lead Free | Tube, 1 lb (454g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
RCBLF22701020PBLF227 ROSIN FLUX 1 LB. .020 DIA |
1,924 |
|
Datasheet | - | Spool | Active | Wire Solder | BLF 227 (99.17Sn/.8Cu/.03Ni) | 0.020" (0.51mm) | 440°F (227°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
SW SN60 .062 1#Sn60Pb40 .062 dia 1 lb. spool |
100 |
|
Datasheet | - | Tape & Box (TB) | Active | Wire Solder | Sn60Pb40 (60/40) | 0.062" (1.57mm) | 361°F (183°C) | - | 14 AWG | - | Leaded | Spool, 1 lb (454 g) | - | Date of Manufacture | Room Temperature |
|
SW SN60 .125 1#60% TIN, 40% LEAD, SOLID WIRE WA |
100 |
|
Datasheet | - | Tape & Box (TB) | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
SW SN97CU3 .12597% Tin, 3% Copper, .125 dia on |
100 |
|
Datasheet | - | Tape & Box (TB) | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
CCBLF22701062BLF 227 NO CLEAN 1 LB. 062 CORE |
100 |
|
Datasheet | - | Spool | Active | Wire Solder | BLF 227 (99.17Sn/.8Cu/.03Ni) | 0.062" (1.57mm) | 440°F (227°C) | No-Clean | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
WC9601062PSACSAC 305 WATER SOLUBLE FLUX 1 LB. |
4,275 |
|
Datasheet | - | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
CC9601031PAG3SAC 305 NO CLEAN 1 LB. .031 DIA |
2,603 |
|
Datasheet | - | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
WC9601031PSAC 305 WATER SOLUBLE FLUX 1 LB. |
3,189 |
|
Datasheet | - | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) |
|
CWSnCu0.7Ni RA3% .062 1#CW SnCu0.7Ni WRAP 3% 0.062 1# SP |
100 |
|
Datasheet | - | Tape & Box (TB) | Active | Wire Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | 0.062" (1.57mm) | 441°F (227°C) | Rosin Activated (RA) | 14 AWG | - | Lead Free | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | Room Temperature |
|
CWSnCu0.7Ni NCCW2.2% .062 1#CW SnCu0.7Ni NCCW 2.2% 0.062 1# |
100 |
|
Datasheet | - | Tape & Box (TB) | Active | Wire Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | 0.062" (1.57mm) | 441°F (227°C) | No-Clean | 14 AWG | - | Lead Free | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | Room Temperature |
|
CWSnCu0.7Ni RMA3% .062 1#CW SnCu0.7Ni WRMAP 3% 0.062 1# S |
100 |
|
Datasheet | - | Tape & Box (TB) | Active | Wire Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | 0.062" (1.57mm) | 441°F (227°C) | Rosin Mildly Activated (RMA) | 14 AWG | - | Lead Free | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | Room Temperature |
|
CWSnCu0.7Ni RA3% .032 1#CW SnCu0.7Ni WRAP 3% 0.032 1# SP |
100 |
|
Datasheet | - | Tape & Box (TB) | Active | Wire Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | 0.032" (0.81mm) | 441°F (227°C) | Rosin Activated (RA) | 20 AWG | - | Lead Free | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | Room Temperature |
|
CWSnCu0.7Ni RMA3% .032 1#CW SnCu0.7Ni WRMAP 3% 0.032 1# S |
100 |
|
Datasheet | - | Tape & Box (TB) | Active | Wire Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | 0.032" (0.81mm) | 441°F (227°C) | Rosin Mildly Activated (RMA) | 20 AWG | - | Lead Free | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | Room Temperature |
Frequently Asked Questions
What are Solder components used for?
Solder components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right Solder part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can ICMENU help source obsolete or hard-to-find Solder parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. ICMENU will review your request and provide available stock, pricing and sourcing information.