IC Sockets
Explore IC Sockets parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to ICMENU. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
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2-210735-5CONN SOCKET SIP 25POS TIN-LEAD |
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Datasheet | - | Bulk | Obsolete | SIP | 25 (1 x 25) | 0.100" (2.54mm) | Tin-Lead | - | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin-Lead | - | - | Thermoplastic | - |
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8080-1G45CONN TRANSIST TO-3 3POS TIN |
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Datasheet | 8060 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Tin | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
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820-AG10D-ESCONN IC DIP SOCKET 20POS GOLD |
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Datasheet | 800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
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5-1437542-2CONN IC DIP SOCKET 28POS GOLD |
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Datasheet | 700 | - | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | Solder | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Aluminum Alloy | -55°C ~ 125°C |
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643647-6CONN SOCKET SIP 15POS TIN |
0 |
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Datasheet | Diplomate DL | Tray | Active | SIP | 15 (1 x 15) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
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9-1437530-4CONN SOCKET SIP 11POS |
0 |
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Datasheet | 500 | Bulk | Obsolete | SIP | 11 (1 x 11) | 0.100" (2.54mm) | - | - | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | - | - | Beryllium Copper | Thermoplastic | - |
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824-AG32DCONN IC DIP SOCKET 24POS TINLEAD |
0 |
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Datasheet | 800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
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1-390261-5CONN IC DIP SOCKET 18POS TIN |
0 |
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Datasheet | - | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | - | -40°C ~ 105°C |
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8080-1G17CONN TRANSIST TO-3 3POS TIN |
0 |
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Datasheet | 8060 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Tin | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
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8080-1G25CONN TRANSIST TO-3 3POS GOLD |
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Datasheet | 8060 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Gold | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
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8059-2G8CONN TRANSIST TO-5 8POS GOLD |
0 |
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Datasheet | 8058 | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
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1825094-4CONN IC DIP SOCKET 16POS GOLD |
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Datasheet | Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
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1825109-3CONN IC DIP SOCKET 40POS GOLD |
0 |
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Datasheet | Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
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1825276-2CONN IC DIP SOCKET 32POS GOLD |
0 |
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Datasheet | Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
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2-821949-4CONN SOCKET PQFP 100POS TIN-LEAD |
0 |
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Datasheet | - | Tube | Obsolete | QFP | 100 (4 x 25) | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
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SIP1X06-014BLFCONN SOCKET SIP 6POS TIN |
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Datasheet | SIP1x | Bulk | Obsolete | SIP | 6 (1 x 6) | 0.100" (2.54mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
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SIP1X05-014BLFCONN SOCKET SIP 5POS TIN |
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Datasheet | SIP1x | Bulk | Obsolete | SIP | 5 (1 x 5) | 0.100" (2.54mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
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SIP1X08-011BLFCONN SOCKET SIP 8POS GOLD |
0 |
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Datasheet | SIP1x | Bulk | Obsolete | SIP | 8 (1 x 8) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
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SIP1X07-014BLFCONN SOCKET SIP 7POS TIN |
0 |
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Datasheet | SIP1x | Bulk | Obsolete | SIP | 7 (1 x 7) | 0.100" (2.54mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
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SIP1X06-011BLFCONN SOCKET SIP 6POS GOLD |
0 |
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Datasheet | SIP1x | Bulk | Obsolete | SIP | 6 (1 x 6) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
Frequently Asked Questions
What are IC Sockets components used for?
IC Sockets components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right IC Sockets part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can ICMENU help source obsolete or hard-to-find IC Sockets parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. ICMENU will review your request and provide available stock, pricing and sourcing information.