IC Sockets
Explore IC Sockets parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to ICMENU. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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100-028-000CONN IC DIP SOCKET 28POS GOLD |
0 |
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Datasheet | 100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-028-001CONN IC DIP SOCKET 28POS GOLD |
0 |
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Datasheet | 100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-032-000CONN IC DIP SOCKET 32POS GOLD |
0 |
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Datasheet | 100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-032-001CONN IC DIP SOCKET 32POS GOLD |
0 |
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Datasheet | 100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-040-000CONN IC DIP SOCKET 40POS GOLD |
0 |
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Datasheet | 100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-040-001CONN IC DIP SOCKET 40POS GOLD |
0 |
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Datasheet | 100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-042-000CONN IC DIP SOCKET 42POS GOLD |
0 |
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Datasheet | 100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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100-048-000CONN IC DIP SOCKET 48POS GOLD |
0 |
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Datasheet | 100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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2-382462-1CONN IC DIP SOCKET 8POS TIN |
0 |
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Datasheet | Diplomate DL | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic | -55°C ~ 105°C |
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2-643574-4CONN IC DIP SOCKET 48POS GOLD |
0 |
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Datasheet | Diplomate DL | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
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382437-3CONN SOCKET SIP 3POS TIN |
0 |
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Datasheet | Diplomate DL | Tray | Obsolete | SIP | 3 (1 x 3) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
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7-1437539-2CONN IC DIP SOCKET 24POS TIN |
0 |
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Datasheet | 800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | - | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
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1825375-3CONN IC DIP SOCKET 40POS GOLD |
0 |
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Datasheet | Diplomate DL | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
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1825375-2CONN IC DIP SOCKET 28POS GOLD |
0 |
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Datasheet | Diplomate DL | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
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1-390261-1CONN IC DIP SOCKET 6POS TIN |
0 |
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Datasheet | - | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | - | -40°C ~ 105°C |
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1-822473-2CONN SOCKET PLCC 28POS TIN |
0 |
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Datasheet | - | Box | Obsolete | PLCC | 28 (4 x 7) | 0.050" (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Thermoplastic | - |
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8058-1G57CONN TRANSIST TO-5 8POS GOLD |
0 |
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Datasheet | 8058 | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
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2-1437530-9CONN SOCKET SIP 12POS |
0 |
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Datasheet | 500 | Bulk | Active | SIP | 12 (1 x 12) | 0.100" (2.54mm) | - | - | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | - | - | Beryllium Copper | Thermoplastic | - |
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816-AG10D-ESCONN IC DIP SOCKET 16POS GOLD |
0 |
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Datasheet | 800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | Copper Alloy | Polyester | -55°C ~ 105°C |
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816-AG11D-ESL-LFCONN IC DIP SOCKET 16POS GOLD |
0 |
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Datasheet | 800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
Frequently Asked Questions
What are IC Sockets components used for?
IC Sockets components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right IC Sockets part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can ICMENU help source obsolete or hard-to-find IC Sockets parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. ICMENU will review your request and provide available stock, pricing and sourcing information.