IC Sockets
Explore IC Sockets parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to ICMENU. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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4818-3000-CPCONN IC DIP SOCKET 18POS TIN |
756 |
|
Datasheet | 4800 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C |
|
08-3518-10TCONN IC DIP SOCKET 8POS GOLD |
579 |
|
Datasheet | 518 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
ICM-324-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 24P |
215 |
|
Datasheet | ICM | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) | -40°C ~ 105°C |
|
SA183000CONN IC DIP SOCKET 18POS GOLD |
769 |
|
Datasheet | SA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Thermoplastic, Polyester, Glass Filled | -40°C ~ 105°C |
|
06-0518-10CONN SOCKET SIP 6POS GOLD |
717 |
|
Datasheet | 518 | Bulk | Active | SIP | 6 (1 x 6) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
ICM-628-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 28P |
706 |
|
Datasheet | ICM | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) | -40°C ~ 105°C |
|
A-CCS 028-Z-SMCONN SOCKET PLCC 28POS TIN |
77 |
|
Datasheet | - | Tube | Active | PLCC | 28 (4 x 7) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polyamide (PA9T), Nylon 9T, Glass Filled | -40°C ~ 105°C |
|
917-47-108-41-005000CONN SOCKET TRANSIST TO-5 8POS |
87 |
|
Datasheet | 917 | Tube | Active | Transistor, TO-5 | 8 (Round) | - | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
917-47-210-41-005000CONN SOCKET TRANSIST TO-5 10POS |
31 |
|
Datasheet | 917 | Tube | Active | Transistor, TO-100 | 10 (Round) | - | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
110-43-308-10-001000CONN IC DIP SOCKET 8POS GOLD |
55 |
|
Datasheet | 110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4), 4 Loaded | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
ICA-308-SGTCONN IC DIP SOCKET 8POS GOLD |
79 |
|
Datasheet | ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled | -55°C ~ 125°C |
|
XR2A-1611-NCONN IC DIP SOCKET 16POS GOLD |
49 |
|
Datasheet | XR2 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
|
110-13-318-41-001000CONN IC DIP SOCKET 18POS GOLD |
90 |
|
Datasheet | 110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
123-13-308-41-001000CONN IC DIP SOCKET 8POS GOLD |
99 |
|
Datasheet | 123 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
110-13-624-41-001000CONN IC DIP SOCKET 24POS GOLD |
48 |
|
Datasheet | 110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
110-99-964-41-001000CONN IC DIP SOCKET 64POS TINLEAD |
95 |
|
Datasheet | 110 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
110-47-964-41-001000CONN IC DIP SOCKET 64POS GOLD |
42 |
|
Datasheet | 110 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
40-0518-11CONN SOCKET SIP 40POS GOLD |
85 |
|
Datasheet | 518 | Bulk | Active | SIP | 40 (1 x 40) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
24-526-10CONN IC DIP SOCKET ZIF 24POS TIN |
62 |
|
Datasheet | Lo-PRO®file, 526 | Bulk | Active | DIP, ZIF (ZIP) | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Beryllium Copper | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
24-6554-10CONN IC DIP SOCKET ZIF 24POS TIN |
63 |
|
Datasheet | 55 | Tube | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
Frequently Asked Questions
What are IC Sockets components used for?
IC Sockets components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right IC Sockets part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can ICMENU help source obsolete or hard-to-find IC Sockets parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
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