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IC Sockets

Explore IC Sockets parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to ICMENU. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
123-43-422-41-001000 Mill-Max Manufacturing Corp.

123-43-422-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

165
Datasheet 123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-93-306-10-001000 Mill-Max Manufacturing Corp.

299-93-306-10-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

543
Datasheet 299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-43-424-41-001000 Mill-Max Manufacturing Corp.

123-43-424-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

300
Datasheet 123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-11-420-41-001000 Mill-Max Manufacturing Corp.

612-11-420-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

223
Datasheet 612 Tube Active DIP, 0.1" (2.54mm) Row Spacing - 0.039" (1.00mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.039" (1.00mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-93-320-41-801000 Mill-Max Manufacturing Corp.

123-93-320-41-801000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

104
Datasheet 123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210815-4 TE Connectivity AMP Connectors

210815-4

CONN SOCKET PGA 223POS GOLD

TE Connectivity AMP Connectors

0
Datasheet - Tube Obsolete PGA 223 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 196.9µin (5.00µm) Phosphor Bronze Thermoplastic, Polyester, Glass Filled -
2174988-2 TE Connectivity AMP Connectors

2174988-2

CONN SOCKET LGA 2011POS GOLD

TE Connectivity AMP Connectors

0
Datasheet - Bulk Obsolete LGA 2011 (47 x 58) 0.040" (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic -
2-822064-4 TE Connectivity AMP Connectors

2-822064-4

CONN SOCKET PQFP 100POS TIN-LEAD

TE Connectivity AMP Connectors

0
Datasheet - Tube Obsolete QFP 100 (4 x 25) 0.025" (0.64mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.025" (0.64mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
123-43-318-41-801000 Mill-Max Manufacturing Corp.

123-43-318-41-801000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

239
Datasheet 123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-318-11-001000 Mill-Max Manufacturing Corp.

299-43-318-11-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

197
Datasheet 299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-93-324-11-001000 Mill-Max Manufacturing Corp.

299-93-324-11-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

157
Datasheet 299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-614-10-002000 Mill-Max Manufacturing Corp.

299-43-614-10-002000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

201
Datasheet 299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
5-1437504-8 TE Connectivity Potter & Brumfield Relays

5-1437504-8

TRANSISTOR SKT

TE Connectivity Potter & Brumfield Relays

0
Datasheet 8080 Bulk Obsolete - - - - - - - - - - - - - - -
299-93-622-10-002000 Mill-Max Manufacturing Corp.

299-93-622-10-002000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

195
Datasheet 299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
1-1554653-1 TE Connectivity AMP Connectors

1-1554653-1

CONN SOCKET LGA 2011POS GOLD

TE Connectivity AMP Connectors

0
Datasheet - Tray Obsolete LGA 2011 (47 x 58) - Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder - Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic -
ICA-640-JGG Samtec Inc.

ICA-640-JGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0
Datasheet ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
123-43-950-41-001000 Mill-Max Manufacturing Corp.

123-43-950-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

179
Datasheet 123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-43-640-41-801000 Mill-Max Manufacturing Corp.

123-43-640-41-801000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

145
Datasheet 123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
6-1437562-9 TE Connectivity ALCOSWITCH Switches

6-1437562-9

TT41NGRA1=SW TOGGLE 4 POLE R/A

TE Connectivity ALCOSWITCH Switches

212
Datasheet * Box Active - - - - - - - - - - - - - - -
299-93-636-10-002000 Mill-Max Manufacturing Corp.

299-93-636-10-002000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.

183
Datasheet 299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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FAQ

Frequently Asked Questions

What are IC Sockets components used for?

IC Sockets components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right IC Sockets part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

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Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

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