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IC Sockets

Explore IC Sockets parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to ICMENU. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
ICA-640-SGT Samtec Inc.

ICA-640-SGT

CONN IC DIP SOCKET 40POS GOLD

Samtec Inc.

15
Datasheet ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
115-93-306-41-001000 Mill-Max Manufacturing Corp.

115-93-306-41-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

133
Datasheet 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-310-41-105000 Mill-Max Manufacturing Corp.

110-93-310-41-105000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

1,148
Datasheet 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-210-41-105000 Mill-Max Manufacturing Corp.

110-43-210-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

154
Datasheet 110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-314-41-105000 Mill-Max Manufacturing Corp.

110-43-314-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

161
Datasheet 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-316-41-105000 Mill-Max Manufacturing Corp.

110-43-316-41-105000

SOCKET IC .300 16POS SMD

Mill-Max Manufacturing Corp.

173
Datasheet 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-13-310-41-001000 Mill-Max Manufacturing Corp.

110-13-310-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

956
Datasheet 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-13-640-41-001000 Mill-Max Manufacturing Corp.

210-13-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

1,135
Datasheet 210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-324-11-001000 Mill-Max Manufacturing Corp.

299-43-324-11-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

176
Datasheet 299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
1-2397198-1 TE Connectivity AMP Connectors

1-2397198-1

SOCKET 4710 FOR ODM

TE Connectivity AMP Connectors

0
Datasheet - Tray Active LGA 4710 0.031" (0.80mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount - Solder 0.031" (0.80mm) Tin - Copper Alloy Thermoplastic -40°C ~ 100°C
1674770-7 TE Connectivity AMP Connectors

1674770-7

HARD TRAY ASSY MPGA479M W/TAPE

TE Connectivity AMP Connectors

6,240
Datasheet - Bulk Active PGA, ZIF (ZIP) 479 (26 x 26) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.050" (1.27mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic -
1-390263-1 TE Connectivity AMP Connectors

1-390263-1

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors

0
Datasheet - Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
2-641296-4 TE Connectivity AMP Connectors

2-641296-4

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors

0
Datasheet Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
2-382462-3 TE Connectivity AMP Connectors

2-382462-3

CONN IC DIP SOCKET 8POS TIN

TE Connectivity AMP Connectors

0
Datasheet Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic -55°C ~ 105°C
1-390262-1 TE Connectivity AMP Connectors

1-390262-1

CONN IC DIP SOCKET 24POS TIN

TE Connectivity AMP Connectors

0
Datasheet - Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze - -40°C ~ 105°C
2-382568-0 TE Connectivity AMP Connectors

2-382568-0

CONN IC DIP SOCKET 20POS TIN

TE Connectivity AMP Connectors

0
Datasheet Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
02-0518-10 Aries Electronics

02-0518-10

CONN SOCKET SIP 2POS GOLD

Aries Electronics

12,441
Datasheet 518 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
2-382465-3 TE Connectivity AMP Connectors

2-382465-3

CONN IC DIP SOCKET 20POS TIN

TE Connectivity AMP Connectors

0
Datasheet Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic -55°C ~ 105°C
346-43-101-41-013000 Mill-Max Manufacturing Corp.

346-43-101-41-013000

CONN SOCKET SIP 1POS GOLD

Mill-Max Manufacturing Corp.

1,753
Datasheet 346 Bulk Active SIP 1 (1 x 1) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
211-1-06-003 CNC Tech

211-1-06-003

CONN IC DIP SOCKET 6POS GOLD

CNC Tech

7,352
Datasheet - Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C
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FAQ

Frequently Asked Questions

What are IC Sockets components used for?

IC Sockets components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

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Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

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