IC Sockets
Explore IC Sockets parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to ICMENU. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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110-83-316-10-003101CONN IC DIP SOCKET 16POS GOLD |
2,664 |
|
Datasheet | 110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8), 8 Loaded | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
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2445893-3DIP IC SOCKET 20P SMT |
3,000 |
|
Datasheet | - | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
D2608-42CONN IC DIP SOCKET 8POS GOLD |
2,312 |
|
Datasheet | D26 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
2485264-4DIP IC SOCKET 18P,GOLD FLASH |
5,280 |
|
Datasheet | - | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
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2445893-2DIP IC SOCKET 16P SMT |
3,000 |
|
Datasheet | - | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
ICO-308-STTCONN IC DIP SOCKET 8POS TIN |
111 |
|
Datasheet | ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | -55°C ~ 105°C |
|
|
2485264-7DIP IC SOCKET 28P,GOLD FLASH |
3,822 |
|
Datasheet | - | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
116-83-314-41-006101CONN IC DIP SOCKET 14POS GOLD |
2,396 |
|
Datasheet | 116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
SMPX-52LCC-PSMT PLCC SOCKET 52P POLARISED RO |
203 |
|
Datasheet | SMPX | Tube | Active | PLCC | 52 (4 x 13) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | Solder | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -50°C ~ 105°C |
|
146-43-308-41-013000CONN IC DIP SOCKET 8POS GOLD |
120 |
|
Datasheet | 146 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
115-83-320-41-001101CONN IC DIP SOCKET 20POS GOLD |
237 |
|
Datasheet | 115 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
110-83-624-41-001101CONN IC DIP SOCKET 24POS GOLD |
1,016 |
|
Datasheet | 110 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
940-44-032-17-400004CONN SOCKET PLCC 32POS SMD |
390 |
|
Datasheet | 940 | Tape & Reel (TR) | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | - | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 200.0µin (5.08µm) | - | Polyphenylene Sulfide (PPS) | - |
|
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ICO-314-MTT.100" LOW PROFILE SCREW MACHINE |
11 |
|
Datasheet | ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | -55°C ~ 105°C |
|
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8452-21B1-RK-TRCONN SOCKET PLCC 52POS TIN |
1,857 |
|
Datasheet | 8400 | Tape & Reel (TR) | Active | PLCC | 52 (4 x 13) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
|
4602CONN TRANSIST TO-3 3POS TIN |
1,759 |
|
Datasheet | - | Bulk | Active | Transistor, TO-3 | 3 (Oval) | - | Tin | - | Brass | Chassis Mount | Closed Frame | Solder | - | Tin | - | Brass | Polyester, Glass Filled | - |
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2485265-1DIP IC SOCKET 40P,GOLD FLASH |
1,950 |
|
Datasheet | - | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 78.7µin (2.00µm) | Copper Alloy | Thermoplastic | -55°C ~ 125°C |
|
540-44-032-17-400004CONN SKT PLCC |
800 |
|
Datasheet | 540 | Tape & Reel (TR) | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Tin | 100.0µin (2.54µm) | - | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 200.0µin (5.08µm) | - | Polyphenylene Sulfide (PPS) | - |
|
123-83-316-41-001101CONN IC DIP SOCKET 16POS GOLD |
1,058 |
|
Datasheet | 123 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
110-93-424-41-001000CONN IC DIP SOCKET 24POS GOLD |
183 |
|
Datasheet | 110 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
Frequently Asked Questions
What are IC Sockets components used for?
IC Sockets components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right IC Sockets part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
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