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IC Sockets

Explore IC Sockets parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to ICMENU. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
110-83-316-10-003101 Preci-Dip

110-83-316-10-003101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2,664
Datasheet 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8), 8 Loaded 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
2445893-3 TE Connectivity AMP Connectors

2445893-3

DIP IC SOCKET 20P SMT

TE Connectivity AMP Connectors

3,000
Datasheet - Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 20 0.100" (2.54mm) Tin 196.9µin (5.00µm) Copper Alloy Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
D2608-42 Harwin Inc.

D2608-42

CONN IC DIP SOCKET 8POS GOLD

Harwin Inc.

2,312
Datasheet D26 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
2485264-4 TE Connectivity AMP Connectors

2485264-4

DIP IC SOCKET 18P,GOLD FLASH

TE Connectivity AMP Connectors

5,280
Datasheet - Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 0.100" (2.54mm) Gold Flash Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
2445893-2 TE Connectivity AMP Connectors

2445893-2

DIP IC SOCKET 16P SMT

TE Connectivity AMP Connectors

3,000
Datasheet - Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 16 0.100" (2.54mm) Tin 196.9µin (5.00µm) Copper Alloy Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
ICO-308-STT Samtec Inc.

ICO-308-STT

CONN IC DIP SOCKET 8POS TIN

Samtec Inc.

111
Datasheet ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
2485264-7 TE Connectivity AMP Connectors

2485264-7

DIP IC SOCKET 28P,GOLD FLASH

TE Connectivity AMP Connectors

3,822
Datasheet - Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 0.100" (2.54mm) Gold Flash Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
116-83-314-41-006101 Preci-Dip

116-83-314-41-006101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

2,396
Datasheet 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SMPX-52LCC-P Kycon, Inc.

SMPX-52LCC-P

SMT PLCC SOCKET 52P POLARISED RO

Kycon, Inc.

203
Datasheet SMPX Tube Active PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -50°C ~ 105°C
146-43-308-41-013000 Mill-Max Manufacturing Corp.

146-43-308-41-013000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

120
Datasheet 146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-83-320-41-001101 Preci-Dip

115-83-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

237
Datasheet 115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-624-41-001101 Preci-Dip

110-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

1,016
Datasheet 110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
940-44-032-17-400004 Mill-Max Manufacturing Corp.

940-44-032-17-400004

CONN SOCKET PLCC 32POS SMD

Mill-Max Manufacturing Corp.

390
Datasheet 940 Tape & Reel (TR) Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150.0µin (3.81µm) - Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
ICO-314-MTT Samtec Inc.

ICO-314-MTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

11
Datasheet ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
8452-21B1-RK-TR 3M

8452-21B1-RK-TR

CONN SOCKET PLCC 52POS TIN

3M

1,857
Datasheet 8400 Tape & Reel (TR) Active PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
4602 Keystone Electronics

4602

CONN TRANSIST TO-3 3POS TIN

Keystone Electronics

1,759
Datasheet - Bulk Active Transistor, TO-3 3 (Oval) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled -
2485265-1 TE Connectivity AMP Connectors

2485265-1

DIP IC SOCKET 40P,GOLD FLASH

TE Connectivity AMP Connectors

1,950
Datasheet - Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 0.100" (2.54mm) Gold Flash Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
540-44-032-17-400004 Mill-Max Manufacturing Corp.

540-44-032-17-400004

CONN SKT PLCC

Mill-Max Manufacturing Corp.

800
Datasheet 540 Tape & Reel (TR) Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 100.0µin (2.54µm) - Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
123-83-316-41-001101 Preci-Dip

123-83-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

1,058
Datasheet 123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-93-424-41-001000 Mill-Max Manufacturing Corp.

110-93-424-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

183
Datasheet 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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FAQ

Frequently Asked Questions

What are IC Sockets components used for?

IC Sockets components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right IC Sockets part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

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