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ELECTRONIC COMPONENTS

IC Sockets

Explore IC Sockets parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to ICMENU. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
614-13-144-12-000012 Mill-Max Manufacturing Corp.

614-13-144-12-000012

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0
Datasheet 614 Bulk Active PGA 144 (12 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-13-223-18-098012 Mill-Max Manufacturing Corp.

614-13-223-18-098012

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0
Datasheet 614 Bulk Active PGA 223 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-13-225-18-091007 Mill-Max Manufacturing Corp.

614-13-225-18-091007

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0
Datasheet 614 Bulk Active PGA 225 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-13-400-20-000001 Mill-Max Manufacturing Corp.

614-13-400-20-000001

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0
Datasheet 614 Bulk Active PGA 400 (20 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-241-18-075012 Mill-Max Manufacturing Corp.

614-93-241-18-075012

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0
Datasheet 614 Bulk Active PGA 241 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
940-44-084-17-400004 Mill-Max Manufacturing Corp.

940-44-084-17-400004

CONN SKT PLCC

Mill-Max Manufacturing Corp.

0
Datasheet 940 Tape & Reel (TR) Active PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 150.0µin (3.81µm) - Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
D01-9933201 Harwin Inc.

D01-9933201

CONNECTOR

Harwin Inc.

0
Datasheet D01-993 Bulk Obsolete SIP 32 (1 x 32) 0.100" (2.54mm) Tin - Brass Through Hole - Solder Cup 0.100" (2.54mm) Tin - Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
8114LB603G Boyd Laconia, LLC

8114LB603G

HEATSINK

Boyd Laconia, LLC

0
Datasheet - - Active - - - - - - - - - - - - - - -
PX-20LCC Kycon, Inc.

PX-20LCC

LEADLESS CHIP CARRIER 20P PBT RO

Kycon, Inc.

0
Datasheet PX Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
PX-28LCC Kycon, Inc.

PX-28LCC

LEADLESS CHIP CARRIER 28P PBT RO

Kycon, Inc.

0
Datasheet PX Tube Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
PX-32LCC Kycon, Inc.

PX-32LCC

LEADLESS CHIP CARRIER 32P PBT RO

Kycon, Inc.

0
Datasheet PX Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
PX-44LCC Kycon, Inc.

PX-44LCC

LEADLESS CHIP CARRIER 44P PBT RO

Kycon, Inc.

0
Datasheet PX Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
PX-52LCC Kycon, Inc.

PX-52LCC

LEADLESS CHIP CARRIER 52P PBT RO

Kycon, Inc.

0
Datasheet PX Tube Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
PX-68LCC Kycon, Inc.

PX-68LCC

LEADLESS CHIP CARRIER 68P PBT RO

Kycon, Inc.

0
Datasheet PX Tube Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
PX-84LCC Kycon, Inc.

PX-84LCC

LEADLESS CHIP CARRIER 84P PBT RO

Kycon, Inc.

0
Datasheet PX Tube Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 75°C
2255-929A-90-2401 3M

2255-929A-90-2401

CONN TEST & BURN-IN BGA SOCKET

3M

0
Datasheet - Bulk Obsolete - - - - - - - - - - - - - - -
2320-9220-02-2401 3M

2320-9220-02-2401

CONN TEST & BURN-IN BGA SOCKET

3M

0
Datasheet - Bulk Obsolete - - - - - - - - - - - - - - -
2432-9235-01-2401 3M

2432-9235-01-2401

CONN TEST & BURN-IN BGA SOCKET

3M

0
Datasheet - Bulk Obsolete - - - - - - - - - - - - - - -
2256-6321-9UA-1902 3M

2256-6321-9UA-1902

GRID ZIP 21 X 21

3M

0
Datasheet Textool™ Bulk Obsolete PGA, ZIF (ZIP) 256 (21 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
276-6321-9UA-1902 3M

276-6321-9UA-1902

TEST BURN-IN PGA

3M

0
Datasheet Textool™ Bulk Obsolete PGA, ZIF (ZIP) 76 (21 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
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FAQ

Frequently Asked Questions

What are IC Sockets components used for?

IC Sockets components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right IC Sockets part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can ICMENU help source obsolete or hard-to-find IC Sockets parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. ICMENU will review your request and provide available stock, pricing and sourcing information.

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