IC Sockets
Explore IC Sockets parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to ICMENU. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
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8080-1G2CONN SOCKET TRANSIST TO-3 3POS |
0 |
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Datasheet | - | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Silver | 500.0µin (12.70µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Silver | - | Beryllium Copper | Diallyl Phthalate (DAP) | -55°C ~ 125°C |
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8080-1G3CONN SOCKET TRANSIST TO-3 3POS |
0 |
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Datasheet | - | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Tin-Lead | - | Beryllium Copper | Phenolic | -55°C ~ 125°C |
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8080-1G35CONN SOCKET TRANSIST TO-3 3POS |
0 |
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Datasheet | - | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin-Lead | 20.0µin (0.51µm) | Beryllium Copper | Diallyl Phthalate (DAP) | -55°C ~ 125°C |
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8080-1G36CONN SOCKET TRANSIST TO-3 3POS |
0 |
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Datasheet | - | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Silver | 500.0µin (12.70µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Silver | 500.0µin (12.70µm) | Beryllium Copper | Phenolic | -55°C ~ 125°C |
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8080-1G37CONN SOCKET TRANSIST TO-3 3POS |
0 |
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Datasheet | - | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Silver | 500.0µin (12.70µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Silver | 500.0µin (12.70µm) | Beryllium Copper | Diallyl Phthalate (DAP) | -55°C ~ 125°C |
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8-1437504-6CONN SOCKET TRANSIST TO-3 3POS |
0 |
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Datasheet | 8080 | Bulk | Active | Transistor, TO-3 | 3 (Oval) | - | Gold | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Diallyl Phthalate (DAP) | -55°C ~ 125°C |
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824-AG66DCONN IC DIP SOCKET 24POS GOLD |
0 |
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Datasheet | 800 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Polyester | -55°C ~ 105°C |
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9-1437537-3CONN IC DIP SOCKET 3POS GOLD |
0 |
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Datasheet | 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 3 (1 x 3) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Polyester | -55°C ~ 105°C |
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9-1437539-6CONN IC DIP SOCKET 6POS GOLD |
0 |
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Datasheet | 800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Polyester | -55°C ~ 105°C |
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2040636-5CONN SOCKET LGA 1567POS GOLD |
0 |
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Datasheet | - | Tray | Active | LGA | 1567 | 0.040" (1.02mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039" (1.00mm) | - | - | Copper Alloy | Thermoplastic | - |
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1977291-1CONN IC DIP SOCKET 20POS GOLD |
0 |
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Datasheet | - | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | - | - | Brass | Thermoplastic, Polyester | - |
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8-1437529-1CONN IC DIP SOCKET 8POS GOLD |
0 |
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Datasheet | 500 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 47.2µin (1.20µm) | Copper Alloy | Thermoplastic, Polyester | -55°C ~ 105°C |
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1825088-2CONN IC DIP SOCKET 12POS GOLD |
0 |
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Datasheet | - | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Press-Fit | 0.100" (2.54mm) | - | - | Brass | Thermoplastic, Polyester | - |
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8-1437531-4520-AG11F=SOCKET ASSY |
0 |
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Datasheet | 500 | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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1747890-1DSL ASSY LGA771 LEADED |
0 |
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Datasheet | - | Tray | Active | LGA | 771 (33 x 33) | 0.043" (1.09mm) | - | - | Copper Alloy | Surface Mount | - | Solder | 0.043" (1.09mm) | Tin | - | - | Thermoplastic | -25°C ~ 100°C |
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1-1981837-2CONN SOCKET LGA 1366POS GOLD |
0 |
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Datasheet | - | Tray | Active | LGA | 1366 (32 x 41) | 0.040" (1.02mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040" (1.01mm) | - | - | - | Thermoplastic | - |
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1825532-4CONN SOCKET SIP 10POS GOLD |
0 |
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Datasheet | - | - | Obsolete | SIP | 10 (1 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | Flash | Beryllium Copper | Polyester | - |
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4-2013620-3CONN SOCKET PGA ZIF 989POS GOLD |
0 |
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Datasheet | - | Tape & Reel (TR) | Active | PGA, ZIF (ZIP) | 989 (35 x 36) | 0.039" (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039" (1.00mm) | Tin-Lead | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic | - |
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1-2013620-1CONN SOCKET PGA ZIF 989POS GOLD |
0 |
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Datasheet | - | Tape & Reel (TR) | Active | PGA, ZIF (ZIP) | 989 (35 x 36) | 0.039" (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039" (1.00mm) | Tin-Lead | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic | - |
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9-6437529-4CONN IC DIP SOCKET 8POS GOLD |
0 |
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Datasheet | - | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Thermoplastic, Polyester | - |
Frequently Asked Questions
What are IC Sockets components used for?
IC Sockets components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right IC Sockets part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can ICMENU help source obsolete or hard-to-find IC Sockets parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. ICMENU will review your request and provide available stock, pricing and sourcing information.