IC Sockets
Explore IC Sockets parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to ICMENU. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
1939416-1CONN SOCKET LGA 1207POS GOLD |
0 |
|
Datasheet | - | Tray | Active | LGA | 1207 (33 x 34) | 0.043" (1.09mm) | Gold | - | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.043" (1.09mm) | - | - | - | Thermoplastic | -55°C ~ 110°C |
|
516-AG7DCONN IC DIP SOCKET 16POS GOLD |
0 |
|
Datasheet | 500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Copper Alloy | Polyester | -55°C ~ 125°C |
|
|
1939416-2CONN SOCKET LGA 1207POS GOLD |
0 |
|
Datasheet | - | Tray | Active | LGA | 1207 (33 x 34) | 0.043" (1.09mm) | Gold | - | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.043" (1.09mm) | - | - | - | Thermoplastic | -55°C ~ 110°C |
|
2-641262-4CONN IC DIP SOCKET 16POS GOLD |
0 |
|
Datasheet | Diplomate DL | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
|
1-1437538-3CONN IC DIP SOCKET 28POS TINLEAD |
0 |
|
Datasheet | 800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
|
|
1554116-2CONN SOCKET LGA 1356POS GOLD |
0 |
|
Datasheet | - | Tray | Obsolete | LGA | 1356 (32 x 41) | 0.040" (1.02mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040" (1.01mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic | -25°C ~ 100°C |
|
|
1554116-3CONN SOCKET LGA 1356POS GOLD |
0 |
|
Datasheet | - | Tray | Obsolete | LGA | 1356 (32 x 41) | 0.040" (1.02mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040" (1.01mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic | -25°C ~ 100°C |
|
|
1761122-1POWER ASSY |
0 |
|
Datasheet | - | Bulk | Active | LGA | 145 | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic, Glass Filled | - |
|
|
1939737-1CONN SOCKET LGA 1366POS |
0 |
|
Datasheet | - | Tray | Obsolete | LGA | 1366 (32 x 41) | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
8059-2G2CONN TRANSIST TO-5 3POS GOLD |
0 |
|
Datasheet | 8059 | Bulk | Obsolete | Transistor, TO-5 | 3 (Round) | - | Gold | - | Copper Alloy | Through Hole | - | Solder | - | Gold | - | Copper Alloy | Polyamide (PA), Nylon | -55°C ~ 125°C |
|
5-1437530-2CONN IC SIP SOCKET 8POS GOLD |
0 |
|
Datasheet | 500 | Tube | Obsolete | SIP | 8 (1 x 8) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin-Lead | - | Brass | Polyester | -55°C ~ 125°C |
|
528-AG11DCONN IC DIP SOCKET 28POS GOLD |
0 |
|
Datasheet | 500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
|
|
808-AG12DCONN IC DIP SOCKET 8POS TIN-LEAD |
0 |
|
Datasheet | 800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
|
506-AG11D-ESCONN IC DIP SOCKET 6POS GOLD |
0 |
|
Datasheet | 500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
|
2-382468-4CONN IC DIP SOCKET 40POS GOLD |
0 |
|
Datasheet | Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Phosphor Bronze | Thermoplastic | -55°C ~ 125°C |
|
2-382712-1CONN IC DIP SOCKET 16POS TIN |
0 |
|
Datasheet | Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
|
8080-1G7CONN TRANSIST TO-3 4POS GOLD |
0 |
|
Datasheet | 8080 | Bulk | Obsolete | Transistor, TO-3 | 4 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Fluoropolymer (FP) | -55°C ~ 125°C |
|
|
822064-5CONN SOCKET PQFP 132POS TIN-LEAD |
0 |
|
Datasheet | - | Tube | Active | QFP | 132 (4 x 33) | 0.025" (0.64mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.025" (0.64mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
|
|
1814655-7CONN SOCKET SIP 10POS GOLD |
0 |
|
Datasheet | - | Bulk | Obsolete | SIP | 10 (1 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Thermoplastic, Polyester | -55°C ~ 125°C |
|
2-382719-1CONN IC DIP SOCKET 30POS TIN |
0 |
|
Datasheet | Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 30 (2 x 15) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
Frequently Asked Questions
What are IC Sockets components used for?
IC Sockets components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right IC Sockets part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can ICMENU help source obsolete or hard-to-find IC Sockets parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. ICMENU will review your request and provide available stock, pricing and sourcing information.