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ELECTRONIC COMPONENTS

IC Sockets

Explore IC Sockets parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to ICMENU. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
145-PRS15062-12 Aries Electronics

145-PRS15062-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
Datasheet PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
145-PLS15024-12 Aries Electronics

145-PLS15024-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
Datasheet PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
145-PRS15024-12 Aries Electronics

145-PRS15024-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
Datasheet PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
132-PRS14033-12 Aries Electronics

132-PRS14033-12

PGA ZIF TEST/BURN-IN SOCKET

Aries Electronics

0
Datasheet PRS - Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -
268-6311-9UA-1902 GRID ZIP (11X11) 3M

268-6311-9UA-1902 GRID ZIP (11X11)

TEXTOOL 268-6311-9UA-1902 PGA 11

3M

0
Datasheet Textool™ Box Obsolete - - - - - - - - - - - - - - -
HLS-1313-G-18 Samtec Inc.

HLS-1313-G-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
Datasheet HLS Bulk Active SIP 169 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
558-10-600M35-001104 Preci-Dip

558-10-600M35-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0
Datasheet 558 Bulk Active BGA 600 (35 x 35) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
518-77-600M35-001105 Preci-Dip

518-77-600M35-001105

CONN SOCKET PGA 600POS GOLD

Preci-Dip

0
Datasheet 518 Bulk Active PGA 600 (35 x 35) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
32-6551-18 Aries Electronics

32-6551-18

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

0
Datasheet 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
163-PRS15065-12 Aries Electronics

163-PRS15065-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
Datasheet PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
169-PLS17012-12 Aries Electronics

169-PLS17012-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
Datasheet PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
169-PRS17012-12 Aries Electronics

169-PRS17012-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
Datasheet PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
169-PRS17053-12 Aries Electronics

169-PRS17053-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
Datasheet PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
518-77-600M35-001106 Preci-Dip

518-77-600M35-001106

CONN SOCKET PGA 600POS GOLD

Preci-Dip

0
Datasheet 518 Bulk Active PGA 600 (35 x 35) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
558-10-652M35-001101 Preci-Dip

558-10-652M35-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

0
Datasheet 558 Bulk Active PGA 652 (35 x 35) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
209-PRS17020-12 Aries Electronics

209-PRS17020-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
Datasheet PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
7100265150 3M

7100265150

TEXTOOLINTERSTITIAL PIN GRID ARR

3M

0
Datasheet - Bulk Active - - - - - - - - - - - - - - -
2100-6310-9UA-1902 3M

2100-6310-9UA-1902

10X10 GRID ZIP SOCKET

3M

0
Datasheet - Bulk Obsolete - 100 (10 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
180-PRS18007-12 Aries Electronics

180-PRS18007-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
Datasheet PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
196-PRS14001-12 Aries Electronics

196-PRS14001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
Datasheet PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
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FAQ

Frequently Asked Questions

What are IC Sockets components used for?

IC Sockets components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right IC Sockets part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can ICMENU help source obsolete or hard-to-find IC Sockets parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. ICMENU will review your request and provide available stock, pricing and sourcing information.

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