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IC Sockets

Review IC Sockets Sockets for ICs, Transistors components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.

If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to ICMENU for sourcing and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
XR2C-0311-N Omron Electronics Inc-EMC Div

XR2C-0311-N

CONN SOCKET SIP 3POS GOLD

Omron Electronics Inc-EMC Div

3,654
Datasheet XR2 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
XR2A-0811-N Omron Electronics Inc-EMC Div

XR2A-0811-N

CONN IC DIP SOCKET 8POS GOLD

Omron Electronics Inc-EMC Div

331
Datasheet XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
XR2A-1401-N Omron Electronics Inc-EMC Div

XR2A-1401-N

CONN IC DIP SOCKET 14POS GOLD

Omron Electronics Inc-EMC Div

251
Datasheet XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
XR2C-2011-N Omron Electronics Inc-EMC Div

XR2C-2011-N

CONN SOCKET SIP 20POS GOLD

Omron Electronics Inc-EMC Div

142
Datasheet XR2 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
XR2C1011N Omron Electronics Inc-EMC Div

XR2C1011N

CONN SOCKET SIP 10POS GOLD

Omron Electronics Inc-EMC Div

395
Datasheet XR2 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
XR2A-0825 Omron Electronics Inc-EMC Div

XR2A-0825

CONN IC DIP SOCKET 8POS GOLD

Omron Electronics Inc-EMC Div

120
Datasheet XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
XR2A-1801-N Omron Electronics Inc-EMC Div

XR2A-1801-N

CONN IC DIP SOCKET 18POS GOLD

Omron Electronics Inc-EMC Div

151
Datasheet XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
XR2A-0815 Omron Electronics Inc-EMC Div

XR2A-0815

CONN IC DIP SOCKET 8POS GOLD

Omron Electronics Inc-EMC Div

118
Datasheet XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
XR2P1041 Omron Electronics Inc-EMC Div

XR2P1041

CONN SOCKET SIP 10POS GOLD

Omron Electronics Inc-EMC Div

795
Datasheet XR2 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
XR2A-1611-N Omron Electronics Inc-EMC Div

XR2A-1611-N

CONN IC DIP SOCKET 16POS GOLD

Omron Electronics Inc-EMC Div

49
Datasheet XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
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FAQ

Frequently Asked Questions

What are IC Sockets components used for?

IC Sockets components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right IC Sockets part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can ICMENU help source obsolete or hard-to-find IC Sockets parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. ICMENU will review your request and provide available stock, pricing and sourcing information.

PART MATCHING & SOURCING

Need Help Narrowing Down the Right IC Sockets Part?

Send your target specifications, preferred manufacturer, quantity or reference part number. Our team can help check matching options, availability and quotation details for your sourcing requirement.

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