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Microprocessors

Review Microprocessors Embedded components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.

If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to ICMENU for sourcing and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Package/Case Series Packaging Product Status Core Processor Number of Cores/Bus Width Speed Co-Processors/DSP RAM Controllers Graphics Acceleration Display & Interface Controllers Ethernet SATA USB Voltage - I/O Operating Temperature Grade Qualification Security Features Mounting Type Supplier Device Package Additional Interfaces
MCIMX7D2DVM12SD NXP USA Inc.

MCIMX7D2DVM12SD

IC MPU I.MX7D 1.2GHZ 541MAPBGA

NXP USA Inc.

168
Datasheet 541-LFBGA i.MX7D Tray Active ARM® Cortex®-A7, ARM® Cortex®-M4 2 Core, 32-Bit 1.2GHz Multimedia; NEON™ MPE LPDDR2, LPDDR3, DDR3, DDR3L No Keypad, LCD, MIPI 10/100/1000Mbps (2) - USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) 1.8V, 3.3V 0°C ~ 85°C (TJ) - - A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Surface Mount 541-MAPBGA (19x19) AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
MIMX8MM5DVTLZAA NXP USA Inc.

MIMX8MM5DVTLZAA

IC MPU I.MX8MM 1.8GHZ 486LFBGA

NXP USA Inc.

133
Datasheet 486-LFBGA, FCBGA i.MX8MM Tray Active ARM® Cortex®-A53 4 Core, 64-Bit 1.8GHz ARM® Cortex®-M4 DDR3L, DDR4, LPDDR4 Yes MIPI-DSI GbE - USB 2.0 + PHY (2) - 0°C ~ 95°C (TJ) - - ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Surface Mount 486-LFBGA (14x14) I2C, PCIe, SDHC, SPI, UART
MCIMX27VOP4A NXP USA Inc.

MCIMX27VOP4A

IC MPU I.MX27 400MHZ 404LFBGA

NXP USA Inc.

652
Datasheet 404-LFBGA i.MX27 Tray Not For New Designs ARM926EJ-S 1 Core, 32-Bit 400MHz Security; SAHARAH2 DDR Yes Keypad, LCD 10/100Mbps (1) - USB 2.0 + PHY (3) 2.0V, 2.5V, 2.7V, 3.0V -20°C ~ 85°C (TA) - - Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory Surface Mount 404-LFBGA (17x17) 1-Wire, AC97, I2C, I2S, IDE, MMC/SD, SPI, SSI, UART
MCIMX6U1AVM08AC NXP USA Inc.

MCIMX6U1AVM08AC

IC MPU I.MX6DL 800MHZ 624MAPBGA

NXP USA Inc.

919
Datasheet 624-LFBGA i.MX6DL Tray Active ARM® Cortex®-A9 2 Core, 32-Bit 800MHz Multimedia; NEON™ SIMD LPDDR2, LVDDR3, DDR3 Yes Keypad, LCD 10/100/1000Mbps (1) - USB 2.0 + PHY (4) 1.8V, 2.5V, 2.8V, 3.3V -40°C ~ 125°C (TJ) - - ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Surface Mount 624-MAPBGA (21x21) CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6S5DVM10ACR NXP USA Inc.

MCIMX6S5DVM10ACR

IC MPU I.MX6S 1.0GHZ 624MAPBGA

NXP USA Inc.

1,578
Datasheet 624-LFBGA i.MX6S Tape & Reel (TR) Active ARM® Cortex®-A9 1 Core, 32-Bit 1.0GHz Multimedia; NEON™ SIMD LPDDR2, LVDDR3, DDR3 Yes Keypad, LCD 10/100/1000Mbps (1) - USB 2.0 + PHY (4) 1.8V, 2.5V, 2.8V, 3.3V 0°C ~ 95°C (TJ) - - ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Surface Mount 624-MAPBGA (21x21) CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6S5DVM10AC NXP USA Inc.

MCIMX6S5DVM10AC

IC MPU I.MX6S 1.0GHZ 624MAPBGA

NXP USA Inc.

1,198
Datasheet 624-LFBGA i.MX6S Tray Active ARM® Cortex®-A9 1 Core, 32-Bit 1.0GHz Multimedia; NEON™ SIMD LPDDR2, LVDDR3, DDR3 Yes Keypad, LCD 10/100/1000Mbps (1) - USB 2.0 + PHY (4) 1.8V, 2.5V, 2.8V, 3.3V 0°C ~ 95°C (TJ) - - ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Surface Mount 624-MAPBGA (21x21) CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6X4EVM10AC NXP USA Inc.

MCIMX6X4EVM10AC

IC MPU I.MX6SX 1GHZ 529MAPBGA

NXP USA Inc.

313
Datasheet 529-LFBGA i.MX6SX Tray Active ARM® Cortex®-A9, ARM® Cortex®-M4 2 Core, 32-Bit 227MHz, 1GHz Multimedia; NEON™ MPE LPDDR2, LVDDR3, DDR3 Yes Keypad, LCD, LVDS 10/100/1000Mbps (2) - USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) 1.8V, 2.5V, 2.8V, 3.15V -20°C ~ 105°C (TJ) - - A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Surface Mount 529-MAPBGA (19x19) AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
MCIMX6U6AVM08AC NXP USA Inc.

MCIMX6U6AVM08AC

IC MPU I.MX6DL 800MHZ 624MAPBGA

NXP USA Inc.

297
Datasheet 624-LFBGA i.MX6DL Tray Active ARM® Cortex®-A9 2 Core, 32-Bit 800MHz Multimedia; NEON™ SIMD LPDDR2, LVDDR3, DDR3 Yes Keypad, LCD 10/100/1000Mbps (1) - USB 2.0 + PHY (4) 1.8V, 2.5V, 2.8V, 3.3V -40°C ~ 125°C (TJ) - - ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Surface Mount 624-MAPBGA (21x21) CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6X4CVM08AB NXP USA Inc.

MCIMX6X4CVM08AB

IC MPU I.MX6SX 800MHZ 529MAPBGA

NXP USA Inc.

375
Datasheet 529-LFBGA i.MX6SX Tray Not For New Designs ARM® Cortex®-A9, ARM® Cortex®-M4 2 Core, 32-Bit 200MHz, 800MHz Multimedia; NEON™ MPE LPDDR2, LVDDR3, DDR3 Yes Keypad, LCD, LVDS 10/100/1000Mbps (2) - USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) 1.8V, 2.5V, 2.8V, 3.15V -40°C ~ 105°C (TA) - - A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Surface Mount 529-MAPBGA (19x19) AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
MCIMX6X4AVM08AB NXP USA Inc.

MCIMX6X4AVM08AB

IC MPU I.MX6SX 800MHZ 529MAPBGA

NXP USA Inc.

215
Datasheet 529-LFBGA i.MX6SX Tray Active ARM® Cortex®-A9, ARM® Cortex®-M4 2 Core, 32-Bit 200MHz, 800MHz Multimedia; NEON™ MPE LPDDR2, LVDDR3, DDR3 Yes Keypad, LCD, LVDS 10/100/1000Mbps (2) - USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) 1.8V, 2.5V, 2.8V, 3.15V -40°C ~ 125°C (TJ) - - A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Surface Mount 529-MAPBGA (19x19) AC'97, CAN, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
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FAQ

Frequently Asked Questions

What are Microprocessors components used for?

Microprocessors components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

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Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

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